All items tagged with voice recognition and DSP (22)

BdSound and Vivoka Join Forces to Boost the World of Voice Assistants

October 24, 2023 by Joao Martins

BdSound and Vivoka Join Forces to Boost the World of Voice Assistants

BdSound and Vivoka, two European pioneers in voice technology, announced a strategic partnership to reshape the landscape of voice assistants. Through this collaboration, BdSound will leverage Vivoka's development framework allowing users to high-level construct tailored voice assistants. And BdSound's audio and speech processing technology will become an integral part of the acoustic front-end tools offered by Vivoka, promising to make voice assistants more accessible and customizable than ever before.

XMOS Announces xcore-voice Next-Generation Solution for Smart Voice Applications

April 3, 2023 by audioXpress Staff

XMOS Announces xcore-voice Next-Generation Solution for Smart Voice Applications

XMOS announced xcore-voice: a complete voice solution built on its xcore platform hardware, software and tools. xcore-voice leverages xcore.ai crossover processor, the third-generation of XMOS’ xcore architecture, combining high performance AI, DSP, I/O and control in a single economical device. The solution provides voice pipeline example designs using XMOS industry-proven audio front-end, incorporating far-field processing and support for third party ISV voice algorithms.

August 30, 2022 by Joao Martins

Soundskrit Debuts World's First Directional MEMS Microphone

Soundskrit has developed a high-performance MEMS microphone that is able to replace traditional microphone arrays with a superior solution. First previewed at CES 2018 to much fanfare, Soundskrit's high-performance directional microphones technology combines hardware and software. The company now announced the availability of its first product, the SKR0400, the world’s first directional MEMS microphone built for the needs of current and future consumer electronics product designs.

AKM Starts Sampling AK7749 DSP-Integrated CODEC for In-Vehicle Voice Applications

August 10, 2022 by audioXpress Staff

AKM Starts Sampling AK7749 DSP-Integrated CODEC for In-Vehicle Voice Applications

Asahi Kasei Microdevices Corporation (AKM) has developed and started the release of samples of the AK7749, an in-vehicle DSP-integrated CODEC with an automatic mode switching function to support voice applications, and a full range of digital and analog input/output interfaces. The AK7749 is a RAM based, highly integrated, programmable digital signal processor, with 4 channel ADCs, 2 channel DACs, a MIC gain amplifier, a line-out amplifier, 4 channel SRCs, and digital audio I/F, all in a space saving small 48-pin QFN package.

AES Audio Product Education Institute Webinar Helps Demystify Beamforming for Voice Applications

July 6, 2022 by Audio Engineering_Society

AES Audio Product Education Institute Webinar Helps Demystify Beamforming for Voice Applications

The Audio Product Education Institute (APEI), an Audio Engineering Society initiative, is promoting a webinar exploring application and optimization of microphone beamforming techniques, and the latest optimizations for voice recognition platforms. The knowledge-sharing online session features presentations from DSP Concepts, Soundskrit, and Fluent.ai, with presentation by Dave Lindberg from DB Enterprises in Hong Kong.

DSP Concepts Closes New Funding Round and Appoints Yuchun Lee as Executive Chairman

January 27, 2022 by Joao Martins

DSP Concepts Closes New Funding Round and Appoints Yuchun Lee as Executive Chairman

DSP Concepts, the company founded by Paul and Chin Beckmann, and the creators of the Audio Weaver DSP platform that powers sound and voice features in many of the world's leading consumer and automotive brands, announced that it has successfully closed $28 million in Series C funding. Joining as leading investor, entrepreneur Yuchun Lee has been appointed as Executive Chairman and is intent on leading the company's growth as the enabler of the "Audio of Things."

SK Broadband AI Sound Max Powered by DSP Concepts and Tuned by Bang & Olufsen

December 20, 2021 by audioXpress Staff

SK Broadband AI Sound Max Powered by DSP Concepts and Tuned by Bang & Olufsen

Is it a Soundbar? Is it a Smart Speaker? Is it a TV Set-Top Box? Korean telecom operator SK Broadband has introduced its new AI Sound Max set-top box and TV sound speaker featuring three-dimensional audio perfectly tuned by Bang & Olufsen and implemented using the power of the Audio Weaver framework by DSP Concepts. The innovative AI Sound Max is a great example of an immersive home entertainment speaker design with sophisticated features built with Audio Weaver.

Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications

January 7, 2021 by audioXpress Staff

Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications

Syntiant Corp., the AI for edge devices chip technology company from Irvine, California, announced the availability of its latest Syntiant NDP120 Neural Decision Processor (NDP), a new generation of special purpose chips for audio and sensor processing for always-on applications in battery-powered devices. The low-power Syntiant Core 2 technology in the NDP120 processor delivers 25x the tensor throughput of the core technology found in earlier Syntiant NDP devices that are currently shipping in high volumes.

CEVA Partners With Fluent.ai to Offer Multilingual Speech Support on Edge Devices

September 16, 2020 by audioXpress Staff

CEVA Partners With Fluent.ai to Offer Multilingual Speech Support on Edge Devices

CEVA and Fluent.ai, a leading provider of on-device, multilingual speech understanding solutions, announced a partnership to offer ultra-low power speech-to-intent solutions for intelligent edge devices. Fluent.ai’s suite of speech-to-intent technologies has been ported and optimized for CEVA’s low power audio and sensor hub DSPs, providing a high performance, robust solution for OEMs and ODMs looking to integrate intelligent voice activation and control into their wearables, consumer devices and IoT products.

Development Kit for Amazon AVS Supports Far-field Voice Interaction with Multiple Microphone Array Options

January 10, 2019 by audioXpress Staff

Development Kit for Amazon AVS Supports Far-field Voice Interaction with Multiple Microphone Array Options

Microchip Technology, via its Microsemi Corporation subsidiary, announced that its AcuEdge ZLK38AVS Development Kit for Amazon Alexa Voice Service (AVS) now introduces far-field voice pick up and the flexibility to build devices with multiple mic array configurations. The audio front-end solution with one, two and three mic configurations reduces bill of materials costs while addressing the requirements of small-form-factor designs.

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