All items tagged with UWB (46)

Ellisys Bluetooth Vanguard Advanced Protocol Analysis System Supports Next-Gen Bluetooth Features

May 29, 2024 by audioXpress Staff

Ellisys Bluetooth Vanguard Advanced Protocol Analysis System Supports Next-Gen Bluetooth Features

Ellisys, a leading provider of protocol test, analysis, and qualification solutions for Bluetooth technology, Universal Serial Bus (USB), and other wired and wireless technologies, announced pre-standard support for several upcoming, unreleased major Bluetooth technological advancements. The company's Vanguard all-in-one Bluetooth protocol analysis system now supports High Data Throughput, Higher Bands, and Channel Sounding capabilities.

World's First UWB Personal Wireless Audio Platform Features AntennaWare Technology

May 10, 2024 by Joao Martins

World's First UWB Personal Wireless Audio Platform Features AntennaWare Technology

Launched at High End 2024, Remora PRO is the world's first wireless audio device to deliver a reliable and robust experience for consumer and professional applications, including latency-critical uses. Based on the platform developed by Sonical with its CosmOS and “appable” software ecosystem, Remora PRO utilizes BodyWave antenna technology to make wireless Ultra Wideband (UWB) audio work flawlessly in a wearable and portable form-factor.

Remora UWB Wireless Audio Solution Unveiled Ahead of 2024 High End Munich Show

May 1, 2024 by Joao Martins

Remora UWB Wireless Audio Solution Unveiled Ahead of 2024 High End Munich Show

Remora is the name of a new business venture and a new wireless audio hardware solution that will be officially launched at the 2024 High End show in Munich. Jumping ahead of technology availability in wireless headphones and earbuds, Remora PRO creates a Ultra-Wideband (UWB) transmitter and receiver solution for the highest wireless audio quality available. The USB-C dongle form factor also introduces the world's first Headphone 3.0 platform from Sonical.

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

April 8, 2024 by audioXpress Staff

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

Ceva announced Ceva-Waves Links, a new family of multiprotocol wireless platform IPs that delivers fully integrated connectivity solutions with Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter, simplifying development and accelerating time to market for next generation, connectivity-rich, MCUs and SoCs. Ceva-Waves Links100, a connectivity platform IP with RF implemented on TSMC 22nm is currently being deployed by a leading OEM in connected devices.

Bang & Olufsen Beoconnect Core Expands Wireless Audio Options with UWB and LC3plus

March 14, 2024 by Joao Martins

Bang & Olufsen Beoconnect Core Expands Wireless Audio Options with UWB and LC3plus

Bang & Olufsen announced Beoconnect Core, described as a new streaming box that turns legacy Bang & Olufsen speakers into a wireless speaker system. But under the hood Beoconnect Core is effectively an extremely advanced hub that combines all legacy connectivity options found in the company's products for more than 30 years with the latest wireless technologies, including UWB, and using Fraunhofer IIS' LC3plus high resolution codec.

AntennaWare Introduces New BodyWave UWB Antennas at Embedded World 2024

March 11, 2024 by Joao Martins

AntennaWare Introduces New BodyWave UWB Antennas at Embedded World 2024

Embedded World, in Nuremberg, Germany (April 9-11, 2024) will be the first opportunity for AntennaWare to present their new BodyWave antennas, which strengthen the company’s offering in the UWB frequency. Available in 2.4Ghz, DECT and UWB models, BodyWave antennas generate waves that flow efficiently around the body and support a communication link even when the body is blocking the signal. This new range of three BodyWave UWB antennas expand options for compact wearable applications.

Qualcomm Unveils FastConnect 7900 Single Chip Wi-Fi, Bluetooth, and UWB

February 29, 2024 by Joao Martins

Qualcomm Unveils FastConnect 7900 Single Chip Wi-Fi, Bluetooth, and UWB

“Find My” type solutions will be available on more Android devices thanks to Qualcomm Technologies’ first single chip solution to integrate Wi-Fi 7, Bluetooth 5.4, and Ultra Wideband (UWB) technologies, enabling seamless proximity experiences such as digital key, object finding and indoor navigation. But FastConnect 7900 is also ready to power new audio, low-power product designs using Bluetooth LE Audio, Qualcomm’s XPAND (Wi-Fi, BLE convergence) and AI-enabled processing.

Ceva Introduces Highly Accurate and Reliable RivieraWaves UWB Wireless Solutions for Consumer and Smart Home

February 26, 2024 by audioXpress Staff

Ceva Introduces Highly Accurate and Reliable RivieraWaves UWB Wireless Solutions for Consumer and Smart Home

On the first day of MWC Barcelona 2024, Ceva announced the general release of its RivieraWaves ultra-wideband (UWB) IP for FiRa 2.0, the latest technical specification released by the FiRa industry consortium promoting standardization and compliance efforts for the widespread adoption of UWB-driven applications. RivieraWaves UWB IP for FiRa 2.0 extends Ceva’s market reach into high-volume UWB navigation, detection and remote control use cases in the smart home, consumer electronics and more.

Sonical and XMOS Develop New UWB/Bluetooth Wireless Audio USB Dongle

December 11, 2023 by Joao Martins

Sonical and XMOS Develop New UWB/Bluetooth Wireless Audio USB Dongle

Sonical, the company pioneering a fully integrated approach for the product development of headphones and hearables, with a real-time operating system that allows consumers to load their own apps, will partner with XMOS for its Headphone 3.0 demonstrations at CES 2024. The two companies will showcase a first joint development that will greatly enhance wireless audio quality with huge benefits to the feature set in Sonical's roadmap.

December 6, 2023 by audioXpress Staff

Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation

Ceva, Inc., introduced a fresh new brand visual identity, logo design and web domain ”ceva-ip.com,” reflecting the company’s commitment to "being the partner of choice for transformative IP solutions that power the smart edge." Ceva is a leading provider of silicon and software IP that makes it possible for low power Edge AI devices to connect, sense and infer data, reliably and efficiently, across multiple high-growth end markets.

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