All items tagged with time-of-flight (7)

Ceva-Waves UWB Low Power Solution Wins Prestigious OFweek China Automotive Industry Award 2024

August 28, 2024 by Cristina Costa

Ceva-Waves UWB Low Power Solution Wins Prestigious OFweek China Automotive Industry Award 2024

Ceva announced that its Ceva-Waves UWB, a low-power ultra-wideband IP for mobile, automotive, consumer and connected devices applications, has been named a winner of the Cabin-Driving Integrated Technology Breakthrough Award at the prestigious OFweek China Automotive Industry Awards, promoted by the OFweek industry and technology network of websites in China.

Qorvo Accelerates UWB Adoption with Fully Integrated Module and Certification for Apple U1 Interoperability

July 26, 2022 by Joao Martins

Qorvo Accelerates UWB Adoption with Fully Integrated Module and Certification for Apple U1 Interoperability

Qorvo announced that it completed MFi certification of interoperability for its Ultra-Wideband (UWB) solutions with the Apple U1 chip used in supported iPhone and Apple Watch models. Qorvo UWB solutions comply with the Nearby Interaction accessory protocol and allow developers to easily design new commercial UWB-enabled accessories. The company also announced a fully integrated Ultra-Wideband (UWB) module that enables robust UWB implementation in automation, safety, and industrial systems.

Metalenz and STMicroelectronics Deliver World's First Optical Metasurface Technology for Consumer Electronics Devices

June 14, 2022 by Cristina Costa

Metalenz and STMicroelectronics Deliver World's First Optical Metasurface Technology for Consumer Electronics Devices

Metalenz, the first company to commercialize meta-optics, and STMicroelectronics announced that ST’s currently released VL53L8 direct Time-of-Flight (dToF) sensor is the highly anticipated market debut of the meta-optics devices developed through their partnership, which was disclosed in June 2021. Metalenz metasurfaces are now on the market, marking the introduction of this revolutionary optical technology in real-world devices.

CEVA Expands Wireless Connectivity Options for Developers with New RivieraWaves UWB Platform

June 24, 2021 by audioXpress Staff

CEVA Expands Wireless Connectivity Options for Developers with New RivieraWaves UWB Platform

CEVA unveiled its new ultra-low power RivieraWaves UWB platform IP targeting mobile, automotive, consumer and IoT applications, lowering the entry barriers for companies to include UWB in their chip designs. With this new solutions, developers are able to benefit from CEVA's combined IP offering of Bluetooth and UWB technologies for new use cases in emerging high-volume applications.

CEVA Announces SensPro High Performance Sensor Hub DSP Architecture for Smart Devices

April 7, 2020 by audioXpress Staff

CEVA Announces SensPro High Performance Sensor Hub DSP Architecture for Smart Devices

CEVA announced a new high performance sensor hub DSP architecture designed to handle the broad range of sensor processing and sensor fusion workloads for contextually-aware devices. The new SensPro device family serves as a hub for processing and fusing of data from multiple sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units. This highly-configurable and self-contained architecture brings together scalar and parallel processing for floating point and integer data types, as well as deep learning training and inferencing.

CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware Connected Devices

January 7, 2020 by audioXpress Staff

CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware Connected Devices

At CES 2020 CEVA unveiled SenslinQ, its first integrated hardware IP and software platform that aggregates sensor fusion, sound and connectivity technologies to enable contextually aware connected devices. The CEVA SenslinQ integrated hardware IP and software platform collects, processes and links data from multiple sensors to enable intelligent devices to understand their surroundings - a key development for augmented hearing using wireless headphones and earbuds.

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

October 4, 2019 by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.