Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC

Nordic Semiconductor announced that Tokyo, Japan-based multinational conglomerate, Toshiba Corporation, has selected the 2.48 by 2.46mm wafer level chip scale package (WLCSP) version of Nordic’s nRF52811 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to provide the core processing power and wireless connectivity for its ‘Bluetooth module with SASP Technology’.

The NFC Forum and the Thread Group announced that they have formed an official partnership by signing a liaison agreement. The goal of the agreement is to provide a new Internet of Things (IoT) user interface experience (UX) by using Near Field Communication (NFC) technology when installing and configuring a device to a Thread network. The organizations plan to collaborate on how NFC technology can be deployed as part of the IoT device installation, configuration and commissioning process on a Thread network.