All items tagged with smart home (238)

New AVA Streaming Audio System and Remote Control Bring New Smart Home Options to CEDIA Channel

March 7, 2022 by Joao Martins

New AVA Streaming Audio System and Remote Control Bring New Smart Home Options to CEDIA Channel

AVA is a new Swiss-American manufacturer of connected home products from the founders of NEEO and former Control4 executives. The company's first products are the AVA 2.1 Streaming Audio System and the AVA Remote, an elegantly designed Android-based dedicated touchscreen device. Combined, the new premium solutions are meant to offer a powerful hub and interface for the smart home and connected devices, available exclusively through the professional installation channel.

Aspinity AML100 Analog Machine Learning Chip Redefines Always-on Power Efficiency for Voice Applications

February 23, 2022 by Cristina Costa

Aspinity AML100 Analog Machine Learning Chip Redefines Always-on Power Efficiency for Voice Applications

Aspinity launched the first member of its analogML family, the AML100, which is the industry’s first and only tiny machine learning (ML) solution operating completely within the analog domain. As such, the AML100 reduces always-on system power by 95%, allowing manufacturers to dramatically extend the battery life of devices and migrate walled powered always-on devices to battery - opening whole new classes of products for voice-first and smart home systems.

The Standards We Need: Do Audio Technologies Matter in the Smart Home?

February 10, 2022 by Joao Martins

The Standards We Need: Do Audio Technologies Matter in the Smart Home?

Matter is an industry-unifying standard for the Smart Home that promises reliable, secure connectivity — a seal of approval that devices will work seamlessly together. But... Do audio technologies matter in the Smart Home? The audio industry needs to get involved in this convergence and interoperability effort. After all, we can already tell a speaker to play a song - thanks to voice recognition technology, AI, and wireless networks - but we still don’t have a transparent wireless audio standard to stream audio to speakers or headphones because basically audio remains restricted by specifications that were not written with audio in mind.

More Than 5.5 Billion Smart Home Matter-Compliant Devices Forecasted to Ship Between 2022 and 2030

February 9, 2022 by audioXpress Staff

More Than 5.5 Billion Smart Home Matter-Compliant Devices Forecasted to Ship Between 2022 and 2030

Still months from its completion, the Matter smart home specification is already driving new products and strategies across the smart home and consumer electronics market. With a host of major players, technology suppliers, and partners already pledged to delivering Matter compliant offerings, the specification is expected to dominate the smart home landscape within five years, according to a new report from market intelligence firm ABI Research.

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

February 3, 2022 by Joao Martins

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

Synaptics announced the SYN4381 Triple Combo system-on-chip (SoC), the first to combine Wi-Fi 6/6E (802.11ax with extended 6 GHz operation), Bluetooth 5.2 (BT 5.2) with BLE Audio and High Accuracy Distance Measurement (HADM), and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer. The solution simplifies product development while supporting 600 Mbps video and data, low-power Thread communication, and platform-agnostic device setup and interoperability.

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

January 28, 2022 by audioXpress Staff

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

Wireless connectivity specialists Telit announced the launch of their new WE310G4 module, which enables manufacturers to add dual-band Wi-Fi and Bluetooth Low Energy (BLE) 5.0 connectivity quickly and cost-effectively to their products. Based on Realtek's Ameba system on chip (SoC), the WE310G4 is ideal for a wide variety of embedded designs, including smart home devices and appliances, wearables, fitness trackers, smart city sensors, aftermarket telematics and industrial automation sensors.

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

January 13, 2022 by Joao Martins

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

NXP Semiconductors announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2 and 802.15.4 (Zigbee, Thread, Z-Wave, Matter) protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive and industrial use cases. The single SoC enables simultaneous transmit and receive for higher performance in smart solutions, and supports Matter, the new interoperable, secure connectivity standard for the smart home.

MaxLinear WAV600 Series-2 Chipset Selected for Wi-Fi Alliance Wi-Fi 6 Release 2 Certification Test Bed

January 6, 2022 by Cristina Costa

MaxLinear WAV600 Series-2 Chipset Selected for Wi-Fi Alliance Wi-Fi 6 Release 2 Certification Test Bed

MaxLinear, the provider of radio frequency (RF), analog, digital and mixed-signal integrated circuits, headquartered in Carlsbad, California, announced that their WAV600 Series-2 Chipset SoCs have been selected as access point test bed devices for the Wi-Fi Alliance Wi-Fi CERTIFIED 6 Release 2 certification process. The test bed uses a MaxLinear WAV615 and two MaxLinear WAV665 Wi-Fi Transceiver SoCs to enable tri-band interoperability testing at 2.4GHz, 5GHz, and 6GHz, delivering on performance and increased network capacity.

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

December 17, 2021 by audioXpress Staff

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

Infineon announced the launch of the new AIROC Bluetooth LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. Infineon’s new AIROC CYW30739 Bluetooth LE and 802.15.4 system on chip (SoC) is offered as a reliable, secure and scalable solution to connect low-power devices in the smart home. To further demonstrate the company’s commitment to Matter, Infineon expanded its role with the Connectivity Standards Alliance (CSA) by joining the Alliance’s Board of Directors as a Promoter Member.

XMOS Strengthens Its Position In Voice Interfaces with XVF3610 and XVF3615 Voice Processors

November 16, 2021 by Joao Martins

XMOS Strengthens Its Position In Voice Interfaces with XVF3610 and XVF3615 Voice Processors

British chip company XMOS announced the launch of the XVF3610 and XVF3615 next generation voice processors. These high-performance two-mic voice interfaces for wireless speakers, TVs, set-top boxes, smart home appliances, gateway products and more, are built on the company's xcore.ai chip infrastructure, and are available in a cost-effective and easy-to-integrate package. XMOS also kick-started an alpha program for its all new ‘Avona’ voice reference design.

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