All items tagged with simulation software (83)

Second Modeling and Measurement Webinar on Designing Audio Devices With Digital Twins Scheduled for October 27

October 21, 2021 by Audio Engineering_Society

Second Modeling and Measurement Webinar on Designing Audio Devices With Digital Twins Scheduled for October 27

The AES Audio Product Education Institute (APEI) continues to explore the practice and benefits of simulation-driven audio architecture design. In the second Modeling and Measurement webinar in this series (October 27, 12pm EDT), experts from COMSOL, JJR Acoustic and Facebook, will describe and detail a real virtual architectural design story. Registration for this webinar is now available.

New APEI Webinar Addresses the Use of Digital Twins for Architecting and Designing Audio Devices

September 16, 2021 by Audio Engineering_Society

New APEI Webinar Addresses the Use of Digital Twins for Architecting and Designing Audio Devices

The AES Audio Product Education Institute (APEI) promotes a new webinar series on its Modeling and Measurement education pillar to explore the use of Digital Twins as a new simulation-driven audio architecture design. With audio development of increasingly sophisticated audio products now starting almost always with the creation of digital models, the possibilities to adjust practices between different teams are driving new audio product development practices.

Rohde & Schwarz and Cadence Combine EDA Simulation with Hardware Testing

September 10, 2021 by audioXpress Staff

Rohde & Schwarz and Cadence Combine EDA Simulation with Hardware Testing

Rohde & Schwarz and Cadence Design Systems have collaborated on a solution aimed at simplifying the engineering process from RF design to implementation and enhancing accuracy by using realistic signals for both simulation and testing. The new R&S VSESIM-VSS signal creation and analysis tool speeds up the development process for RF components and is particularly useful manufacturers of active components and systems.

AES Audio Product Education Institute Explains Simulation and Testing for Speakers and Microphones

August 6, 2021 by Audio Engineering_Society

AES Audio Product Education Institute Explains Simulation and Testing for Speakers and Microphones

The AES Audio Product Education Institute (APEI) will promote a new free webinar on its Modeling and Measurement education pillar, this time addressing “Speakers and Microphones: Simulation and Testing,” on Wednesday, August 11 (12:00pm EDT). This webinar will feature presentations from COMSOL, and HEAD acoustics exploring spatial responses of speakers and microphones, and echo cancellation testing techniques.

AES Audio Product Education Institute Presents “Modeling and Measurement of True Wireless Stereo (TWS) Wearables”

July 16, 2021 by Audio Engineering_Society

AES Audio Product Education Institute Presents “Modeling and Measurement of True Wireless Stereo (TWS) Wearables”

The AES Audio Product Education Institute (APEI), created to promote methodologies, practices and technologies involved in developing and bringing audio products to market, is producing a free webinar focused on True Wireless Stereo (TWS) design on Tuesday, July 20 (12:00pm EDT). This webinar will focus on the fastest-growing category in consumer electronics with presentations from COMSOL, Listen, and JJR Acoustics detailing modeling, simulation and measurement of true wireless earbuds.

Klippel New dB-Lab Version 212 and QC 7 Updates Extend Speaker and Enclosure Characterization Tools

July 1, 2021 by audioXpress Staff

Klippel New dB-Lab Version 212 and QC 7 Updates Extend Speaker and Enclosure Characterization Tools

Klippel released a major software update to its Klippel Analyzer System. The new dB-Lab Version 212 and QC 7 updates now add shared sensor management, support for the new Multi-Scanning Workbench hardware and three further modules (LSIM, MTON, RMA). The Klippel Multi-Scanning Workbench supports near-field holographic soundfield scanning measurements in a much smaller form factor, while the new modules add linear signal modeling and simulation and multi-tone measurements, dedicated to speaker and enclosure design.

Achieving Loudspeaker Design Goals Using Multiphysics Simulation

June 11, 2021 by audioXpress Staff

Achieving Loudspeaker Design Goals Using Multiphysics Simulation

Dolby Laboratories and COMSOL join the Audio Product Education Institute in a discussion on the role of modeling and measurements in the loudspeaker design process. The webinar, June 16 (12pm EDT) shares speaker design project experiences, detailing how simulation, measurements, and experiments help in meeting projects' requirements. The use of simulation in audio system design and multiphysics modeling of loudspeakers is addressed.

Electro-Voice Launches Preview Software for Quick, Precise Loudspeaker Coverage Prediction

June 4, 2021 by audioXpress Staff

Electro-Voice Launches Preview Software for Quick, Precise Loudspeaker Coverage Prediction

Electro-Voice introduced Preview, a new platform-independent software application designed to configure Electro-Voice line-array loudspeakers for optimized coverage. The software provides efficient system setup by creating visualizations of coverage, SPL, frequency response and precise mechanical load calculations. Preview quickly calculates the ideal loudspeaker configuration with a full-color 3D interface and recommends mechanically valid combinations of loudspeakers and rigging hardware.

SnapEDA Makes PCB Part Libraries Available Inside Autodesk Fusion 360, ExpressPCB, DipTrace and Proteus PCB

March 12, 2021 by audioXpress Staff

SnapEDA Makes PCB Part Libraries Available Inside Autodesk Fusion 360, ExpressPCB, DipTrace and Proteus PCB

SnapEDA, the electronics design search engine, released SnapEDA for Fusion 360 in collaboration with Autodesk. Electronics designers can now search and place free cloud-based symbols, footprints and 3D models from SnapEDA directly within Fusion 360. And the SnapEDA search engine for electronics design is now also integrated through plug-ins available for popular software tools such as ExpressPCB, DipTrace and Proteus PCB, among others.

COMSOL Releases Multiphysics Version 5.6 with Four New Products and Valuable New Features in the Acoustics Module

November 12, 2020 by audioXpress Staff

COMSOL Releases Multiphysics Version 5.6 with Four New Products and Valuable New Features in the Acoustics Module

As anticipated, COMSOL unveiled its Multiphysics Version 5.6 Software Suite introducing faster and more memory lean solvers, efficient CAD assembly handling, clip planes, layout templates for building apps, and four new products: Fuel Cell & Electrolyzer Module, LiveLink for Simulink, Polymer Flow Module, and Liquid & Gas Properties Module. Important news in the Acoustics Module include a new time explicit Nonlinear Acoustics interface that uses the dG-FEM technology, a new feature to model Nonlinear Thermoviscous Acoustics, mechanical Port boundary conditions for elastic waves, and much more.

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