All items tagged with product development and wireless stereo (7)

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

November 17, 2022 by Joao Martins

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

During its Snapdragon Summit 2022, Qualcomm unveiled the latest generation of Snapdragon processors and chips that will power mobile devices, wearables and countless consumer electronics and audio devices to be introduced in 2023. The Snapdragon S5 Gen 2, and the Snapdragon S3 Gen 2 Bluetooth audio chipsets are the evolution from the devices announced in 2022, designed to support Bluetooth LE Audio.

Designed for Growth: Enabling Product Differentiation for TWS Development

March 23, 2022 by Raj Senguttuvan

Designed for Growth: Enabling Product Differentiation for TWS Development

Knowles announced the availability of a new development kit for true wireless stereo (TWS) earbuds, centered on the capabilities of its AISonic family of audio edge-AI processors and expanded by key partnerships in voice and audio processing algorithms for TWS products. This article details the opportunities for TWS development and helping manufacturers to differentiate their newest designs. This article was originally published in audioXpress, January 2022.

Packetcraft Announces Bluetooth 5.3 Qualification and LC3 Codec for LE Audio

October 5, 2021 by audioXpress Staff

Packetcraft Announces Bluetooth 5.3 Qualification and LC3 Codec for LE Audio

Wireless software licensor Packetcraft, Inc. announced its Packetcraft Controller software has achieved Bluetooth 5.3 qualification, including the world’s first qualification of new Bluetooth 5.3 link layer technical features. Packetcraft also announced the availability of Packetcraft LC3, a highly optimized and efficient LC3 codec for Bluetooth LE Audio.

CEVA Speeds the Development of True Wireless Stereo Earbuds with Support of Bluetooth LE Audio

January 8, 2020 by audioXpress Staff

CEVA Speeds the Development of True Wireless Stereo Earbuds with Support of Bluetooth LE Audio

CEVA, the wireless connectivity specialist, announced that it has enhanced its offerings for developers of true wireless stereo (TWS) earbuds and other wireless audio devices with the general release of the RivieraWaves Bluetooth Low Energy and Dual Mode IPs with support for LE Audio, the next generation of Bluetooth audio. The CEVA solution introduces new features that enhance audio quality and link robustness as well as enabling new audio sharing use cases.

Tempow and CEVA Partner to Deliver Low Power, Low Latency True Wireless Stereo Technology for Bluetooth Earbuds

November 29, 2018 by audioXpress Staff

Tempow and CEVA Partner to Deliver Low Power, Low Latency True Wireless Stereo Technology for Bluetooth Earbuds

CEVA, the leading licensor of signal processing platforms for connected devices, along with French wireless audio pioneer Tempow, unveiled a collaboration to bring next-generation True Wireless Stereo (TWS) to the Bluetooth earbud mass market. As mentioned in a recent article by CEVA's Marketing Director, Franz Dugand, the resulting joint IP solution delivers synchronized left/right audio over standard Bluetooth dual mode connected links with short latency and without the power consumption penalty associated with many of today’s TWS implementations.

Sonova Announces SWORD 3.0 Wireless Chip for Hearing Aids with CEVA Bluetooth IP

November 27, 2018 by audioXpress Staff

Sonova Announces SWORD 3.0 Wireless Chip for Hearing Aids with CEVA Bluetooth IP

CEVA announced that Sonova Holding AG, a leading provider of hearing solutions, has licensed and deployed CEVA’s RivieraWaves Bluetooth IP in its latest SWORD 3.0 wireless chip for hearing aids and other smart hearing devices. The latest generation wireless chip leverages RivieraWaves’ Bluetooth dual mode IP and Sonova’s ultra-low power communication technology to enable true stereo audio streaming to hearing aids.

Dialog Semiconductor Demonstrates Bluetooth Low Energy True Wireless Stereo Solution at Bluetooth World 2018

September 19, 2018 by audioXpress Staff

Dialog Semiconductor Demonstrates Bluetooth Low Energy True Wireless Stereo Solution at Bluetooth World 2018

Claiming an industry-first technology to address the challenges associated with power consumption in true wireless stereo systems, Dialog Semiconductor introduced an audio over Bluetooth low energy proof of concept running on its widely adopted SmartBond SoC’s, the first implementation to solely make use of Bluetooth low energy. This technology, which Dialog is unveiling at Bluetooth World 2018 (September 18-19) in Santa Clara, allows for best-in-class audio synchronization between left and right channels, and addresses the challenges associated with power consumption.