Packetcraft Introduces Wireless Multi-Microphone Demo Kit based on Bluetooth LE Audio to Accelerate New Category of Peripherals

At CES 2024, Packetcraft announced a new Wireless Multi-Microphone Demo Kit based on Bluetooth LE Audio technology that incorporates the company’s newly available Link Robustness Package. Packetcraft’s software solution supports a new standards-based ultra-low latency solution for wireless microphone accessories. These can typically be integrated into mobile devices and computers, in addition to supporting specialized commercial audio applications, voice announcement systems, and conference room wireless microphones.

TDK Corporation has announced its latest compact noise suppression filters MAF1005FR series, measuring 1mm (L) x 0.5mm (W) x 0.5mm (H). These multilayer chip components are designed to improve sound quality and reduce noise interference in the audio lines (sound lines) of smartphones, portable devices, and wearables. Mass production of the new EMC components series started in November 2023.

Nordic Semiconductor has revealed that Yinzida Technology, a consumer electronics manufacturer, has designed a 2.4GHz wireless audio transmission module that enables high fidelity wireless audio in applications such as microphones, musical instruments or audio headsets. This out-of-the-box, lossless and stable wireless audio solution is ideal for battery-powered designs with zero-delay DSP pipeline, using Nordic's nRF52832 SoC in both transmitter and receiver.

Virscient, announced a new strategic collaboration with Infineon to support customers' design-in of Infineon’s connectivity products. Under this agreement, Virscient will provide expert design and engineering services, and licensable software solutions to help innovative OEMs and platform vendors rapidly deliver products integrating Infineon's AIROC Wi-Fi + Bluetooth combo ICs – whether chip-down, or in modular form.