All items tagged with product development and Wi-Fi 6 (15)

STMicroelectronics Introduces First STM32 Wireless Module Leveraging Collaboration with Qualcomm

December 10, 2024 by Cristina Costa

STMicroelectronics Introduces First STM32 Wireless Module Leveraging Collaboration with Qualcomm

STMicroelectronics introduced the first result of its strategic collaboration with Qualcomm Technologies to simplify development of next-generation STM32-based wireless solutions. The new ST67W611M1 modules combine Wi-Fi6, Bluetooth 5.3 and Thread connectivity to accelerate development of advanced consumer wireless solutions. Applications in home audio and smart home, powered by edge AI are a natural use case.

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

March 13, 2024 by Joao Martins

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

Under the theme of "Realtek AI Changing the Future," the Taiwan semiconductor company will exhibit at the AWE China Expo (March 14-17, 2024), at the Shanghai New International Expo Centre (SNIEC). Showcasing the possibilities of AI in connected applications, Realtek will present a hybrid AIoT Audio SoC that supports both dual‑band Wi‑Fi 6 (2.4GHz/5GHz) and dual-mode Bluetooth 5.2 to enable low-latency, high resolution audio playback applications.

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

January 12, 2024 by audioXpress Staff

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

Frontier Smart Technologies unveiled a collaboration with Realtek for its AURIA Bluetooth LE Audio and Wi-Fi module, which features Auracast support. The audio module has been designed and engineered for simple integration into various audio products, and comes with a customizable SDK, rich I/O, comprehensive documentation and technical support. The latest Realtek Ameba chips ensure support for the latest technologies.

Frontier Introduces AURIA Bluetooth LE Audio, Auracast, and Wi-Fi Turnkey Platform

October 10, 2023 by Joao Martins

Frontier Introduces AURIA Bluetooth LE Audio, Auracast, and Wi-Fi Turnkey Platform

Following a presentation at IFA 2023 in Berlin, Frontier Smart Technologies is now launching its first Bluetooth Low Energy (LE) Audio and Wi-Fi module, ready for use in consumer products. The new AURIA board also features Auracast support, allowing Bluetooth audio synchronization across multiple speakers. The module has been designed and engineered for simple and straightforward integration into various audio products, and comes with a customizable SDK, rich I/O, comprehensive documentation and technical support.

StreamUnlimited Announces Stream2Go Product Line at IFA 2023

August 31, 2023 by Joao Martins

StreamUnlimited Announces Stream2Go Product Line at IFA 2023

Expanding on its range of solutions for audio manufacturers, at IFA 2023 in Berlin, StreamUnlimited introduced a new turn-key platform with five software package options, streamlining product development. Based on a single hardware platform, Stream2Go features different software build options that are carefully configured to offer a suitable product line for different segments and categories. From smart audio to connected appliances, developers can choose from these ready to use packages and still offer cutting edge technologies including support for Bluetooth LE Audio, and any of the available streaming service options.

Renesas Lays Out Roadmap for Wi-Fi 6/6E and 7 Chipsets

November 18, 2022 by Joao Martins

Renesas Lays Out Roadmap for Wi-Fi 6/6E and 7 Chipsets

During the electronica 2022 show in Munich, Germany, Renesas Electronics unveiled plans to deliver a comprehensive set of advanced Wi-Fi offerings to complement its broad portfolio of industrial and connected products. In 2021, Renesas completed its acquisition of Celeno, a company from Israel specializing in wireless communication solutions, including advanced Wi-Fi chipsets for high-performance home networks, and is leveraging that technology to address a wide range WLAN access point applications for Wi-Fi 6/6E and Wi-Fi 7.

Realtek Announces New 5th Generation Ameba E Series Solutions

October 27, 2022 by Joao Martins

Realtek Announces New 5th Generation Ameba E Series Solutions

Redefining smart connectivity, Realtek launched its new 5th generation Ameba E series solutions that allow smart products to have the ability to perceive, interact, and determine actions to take. The new SoCs and modules support powerful edge computing, allowing home appliances to be converted into multifunctional smart systems, according to various time or scene settings. Apart from introducing a boost in computation and DSP, the new Ameba E series supports Bluetooth LE Audio, Wi-Fi 6 and Matter.

Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference

September 16, 2022 by Joao Martins

Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference

Silicon Labs announced a slate of new multiprotocol connectivity products that are driven by interoperability, advancing innovations in the Internet of Things and Smart Home, including Matter and Wi-Fi 6. Standing out among the announcements is the new low power SiWx917 Wi-Fi 6 and Bluetooth LE combination SoC that Silicon Labs says is Matter-ready. The SoC includes an integrated applications processor, and is ideal for battery-powered or energy-efficient connected devices with always-on cloud connectivity.

Nordic Semiconductor Announces Its First Wi-Fi Chip

August 19, 2022 by Cristina Costa

Nordic Semiconductor Announces Its First Wi-Fi Chip

Following the acquisition of the Wi-Fi development team, core Wi-Fi expertise, and Wi-Fi IP tech assets of Imagination Technologies Group in 2020, Nordic Semiconductor announced its entry into the Wi-Fi wireless market with the introduction of the nRF7002, an ultra-low power, dual-band Wi-Fi 6 companion IC. The launch enables Nordic Semiconductor to offer all three of the world’s most popular wireless connectivity technologies: Bluetooth, Wi-Fi, and cellular, paving the way for new market opportunities.

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

January 13, 2022 by Joao Martins

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

NXP Semiconductors announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2 and 802.15.4 (Zigbee, Thread, Z-Wave, Matter) protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive and industrial use cases. The single SoC enables simultaneous transmit and receive for higher performance in smart solutions, and supports Matter, the new interoperable, secure connectivity standard for the smart home.

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