All items tagged with product development and voice processing (10)

Voicemod Makes AI-Powered Sing-to-Sing Technology Available to Developers

July 5, 2024 by Joao Martins

Voicemod Makes AI-Powered Sing-to-Sing Technology Available to Developers

Voicemod's Sing-to-Sing AI technology enables users to modify their singing voice in real-time, including pitch, timbre adjustments and automatic voice tuning with features such as choir, duet, evolver and calitune. For the first time, Voicemod's Sing-to-Sing AI technology is available for third-party developers and hardware manufacturers via Voicemod's SDK, which also supports the company's Speech-to-Speech and Soundboard functionalities.

Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%

June 27, 2023 by audioXpress Staff

Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%

Dolphin Design, a semiconductor designer of power management, audio, and processing devices with in-house ASIC design services, announced the launch of WhisperExtractor, a mixed-signal technology for voice and audio-enabled SoCs, enabling voice and sound classification at a record µW level power budget. The new technology paves the way to breakthrough always-on voice user interface, real time speech-to-text, and always-on sound detection.

Vesper Launches 2nd Generation Smart Piezoelectric Voice Accelerometer with ZeroPower Sensing

March 28, 2022 by Joao Martins

Vesper Launches 2nd Generation Smart Piezoelectric Voice Accelerometer with ZeroPower Sensing

Vesper continues to redefine its range of MEMS solutions for voice applications with the launch of the VA1210, Vesper’s 2nd generation analog piezoelectric smart voice accelerometer. The VA1210 offers higher sensitivity (+17 dB) and higher (+6 dB) SNR than the 1st generation VA1200 in voice pickup. Additionally, new intelligent features of Wake-on-Voice (WoV) and hardware voice activity detection (HVAD), introduced into the VA1210, enable a drastic improvement of voice quality True Wireless Stereo (TWS) earbuds.

Synaptics Announces AudioSmart AS33970 Edge AI Headset Platform

October 18, 2021 by audioXpress Staff

Synaptics Announces AudioSmart AS33970 Edge AI Headset Platform

Synaptics announced its newest AudioSmart AS33970 headset platform SoC, directly targeting the fastest growing product categories, from work-from-anywhere TWS earbuds to hearables. As the San Jose, California-based company details, the new SoC offers the world’s first highly integrated AI-enabled ENC (Environmental Noise Cancellation) and hybrid ANC (Active Noise Cancellation) single-chip solution integrating neural and voice processing engines for optimal audio performance.

NXP Semiconductors Completes Acquisition of Retune DSP

August 30, 2021 by Joao Martins

NXP Semiconductors Completes Acquisition of Retune DSP

NXP expanded its already broad portfolio of voice enablement solutions with the acquisition of Retune DSP, the Denmark-based provider of Digital Signal Processing (DSP) software and algorithms for voice control and communication applications. Announced in July and now confirmed, the acquisition of Retune DSP adds three powerful voice DSP software products that will merge with NXP’s voice solutions. The combination with NXP’s broad customer base, global footprint and scale, promises to expand breakthrough voice solutions through combined R&D, sales force and customer support teams.

Alango Extended Voice Communication Package Available for DBMD7 Processor from DSP Group

July 2, 2021 by audioXpress Staff

Alango Extended Voice Communication Package Available for DBMD7 Processor from DSP Group

DSP Group and Alango Technologies announced the availability of Alango’s Extended Voice Communication Package (eVCP), a universal software package of digital signal processing technologies for voice applications, running on DSP Group’s DBMD7 SmartVoice processor. The combination allows companies developing high-performance voice conferencing systems to quickly bring to market solutions with the best in voice clarity and system flexibility.

DSP Group Ships 100 Million SmartVoice SoCs

October 13, 2020 by audioXpress Staff

DSP Group Ships 100 Million SmartVoice SoCs

Demonstrating the importance of voice as a user interface in applications ranging from smartphones, tablets and laptops/PCs, to the smart home, wearables, and all types of connected devices, DSP Group announced it has shipped its 100 millionth SmartVoice system-on-chip (SoC), marking a major milestone in the journey of voice user interfaces (VUIs) from a novelty to a necessity. This milestone is testimony to the importance DSP Group’s customers, including Google, Amazon, Facebook, GoPro, Logitech, Samsung, Lenovo, and Leviton all place on end-user VUI experience.

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

September 14, 2020 by audioXpress Staff

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

Ambiq unveiled its latest Apollo4 SoC family, enabling next generation endpoint devices with record-setting energy efficiency - running as low as 3µA/MHz - and new levels of performance. The new Apollo4 systems enable manufacturers to create leading-edge endpoint devices leveraging the unique SPOT platform with Ambiq’s easy-to-use, rich peripheral set. The Apollo4 is available now with CSP and BGA package offerings, as well as an Apollo4 Blue SoC with Bluetooth LE.

Lattice Announces Nexus Low Power FPGA Platform for Edge Applications

December 10, 2019 by Cristina Costa

Lattice Announces Nexus Low Power FPGA Platform for Edge Applications

Lattice Semiconductor announced its new low power FPGA platform, Lattice Nexus. The platform is architected to deliver power-efficient performance that will benefit developers of a wide range of applications, including voice processing and edge computing for connected devices. Built with innovations at every level of design, from solutions, to architecture, to circuit, the new Lattice Nexus FPGAs deliver higher system performance at significantly reduced power consumption.

DSP Group and LISNR Partner to Create Ultra-low Power Audio-Enabled Data Transmission Solution

August 22, 2017 by audioXpress Staff

DSP Group and LISNR Partner to Create Ultra-low Power Audio-Enabled Data Transmission Solution

Wireless communications chipset specialist, DSP Group and LISNR, a global provider of data-over-audio technology, developed the Audio-D, a solution that supports data-over-audio communication for any device with a speaker or microphone. This solution, based on DSP Group’s DBMD4 Voice SoC and LISNR technology, overcomes device-to-device hardware restraints regarding RF protocols. This enables always-on communication and high level of interoperability while consuming low power.