All items tagged with product development and true wireless stereo (19)

Arendi Launches Nordic-Powered Auracast TV Streamer

July 16, 2024 by Joao Martins

Arendi Launches Nordic-Powered Auracast TV Streamer

Swiss embedded electronics designer, Arendi, has unveiled a Bluetooth LE Audio and Auracast broadcast audio TV streamer. The Arendi Auracast TV Streamer employs Nordic Semiconductor's dual core nRF5340 SoC and nRF21540 RF front-end module (FEM) to deliver low power, long range, reliable wireless connectivity with improved audio quality. The streamer provides stereo audio to both Bluetooth LE Audio or Auracast-enabled headphones, speakers, or hearing aids.

Qualcomm S7 Pro, Micro-Power Wi-Fi, and XPAN Technology

March 14, 2024 by Joao Martins

Qualcomm S7 Pro, Micro-Power Wi-Fi, and XPAN Technology

Qualcomm S7 Pro, Micro-Power Wi-Fi, and XPAN Technology. An interview with John Turner, Senior Director, Product Management Voice and Music at Qualcomm Technologies International about the new Qualcomm S7 Pro platform that brings micro-power Wi-Fi and Bluetooth LE Audio to TWS earbuds. The same battery life, much better quality, high-res lossless audio, longer range, same user experience as Bluetooth on TWS earbuds. How does it work?

Fresh From the Bench: Knowles KN2 True Wireless Reference Design and Franklin 2 Developer Kit

October 12, 2023 by Brent Butterworth

Fresh From the Bench: Knowles KN2 True Wireless Reference Design and Franklin 2 Developer Kit

In this valuable review for product developers, Brent Butterworth shares what he learned about two evaluation solutions intended for designers of true wireless earbuds, the fastest growing product category in the audio industry. With this reference design and developer kit, Knowles made it easier for companies to add sophisticated true wireless earphones to their lines — whether they develop their own design or adopt one that’s ready to go. audioXpress tried out both options.

audioXpress November 2023 Takes You to the Edge of Audio Development

October 11, 2023 by audioXpress Staff

audioXpress November 2023 Takes You to the Edge of Audio Development

audioXpress November 2023 offers an exclusive in-depth report on optical MEMS microphone technology from sensiBel, and understand how microphones can impact active noise cancellation performance. Learn how a new ADC Hybrid Gain Control IC enables smooth microphone preamp gain changes, and how to use DSP for hearing enhancement applications. Explore a Motion Feedback (MFB) approach enabling effective active desktop subwoofers, and recap on a century of Home Loudspeaker Development.

HEAD acoustics ViBRIDGE: Holistic Testing of In-Ear Headsets with Bone Conduction Sensors

July 26, 2023 by audioXpress Staff

HEAD acoustics ViBRIDGE: Holistic Testing of In-Ear Headsets with Bone Conduction Sensors

With the availability of the HEL/HER 4.4 ViBRIDGE Flexible Pinna for HMS II.3/5, the industry as gained a vital testing tool for in-ear headset designs that utilize bone conduction sensors. Evaluating these systems is vital to optimize near-end structure-borne sound to improve speech quality in the presence of background noise, improve echo cancellation, and double-talk performance. The unique technology developed by HEAD acoustics is being enthusiastically embraced by the industry.

TDK Redefines True Wireless Stereo Applications with VibeSense360 Solution Suite

May 4, 2023 by Joao Martins

TDK Redefines True Wireless Stereo Applications with VibeSense360 Solution Suite

TDK Corporation announced the availability of its InvenSense VibeSense360 TWS solution suite, previewed at CES 2023. VibeSense360 is a comprehensive portfolio of TDK hardware and software solutions designed to help solve some of the most complicated problems OEMs face when designing true wireless stereo (TWS) products with state-of-the-art features. On the hardware VibeSense360 includes the TWS-M601 6-axis IMU, and the TWS-M602 device, combining IMU, accelerometer and machine learning on-chip.

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

January 23, 2023 by audioXpress Staff

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

Fluent.ai announced an embedded voice recognition solution for True Wireless Stereo (TWS) and other hearable products running on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary. The solution is part of an integration available on DSP Concepts’ Audio Weaver platform, which provides OEMs a rapid way to design and prototype audio features and capabilities.

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

November 17, 2022 by Joao Martins

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

During its Snapdragon Summit 2022, Qualcomm unveiled the latest generation of Snapdragon processors and chips that will power mobile devices, wearables and countless consumer electronics and audio devices to be introduced in 2023. The Snapdragon S5 Gen 2, and the Snapdragon S3 Gen 2 Bluetooth audio chipsets are the evolution from the devices announced in 2022, designed to support Bluetooth LE Audio.

Why Buy Four Chips if You Only Need One?

November 1, 2022 by Special Content

Why Buy Four Chips if You Only Need One?

Azoteq recently expanded its offering to the TWS market with the release of the IQS323. The IQS323 offers capacitive and inductive sensing as user interface and in-ear-detection, whilst the IQS7222A IC is a multifunctional capacitive, inductive, and Hall-effect sensor with additional temperature sensing for reference tracking. The IQS7222A is offered in a 1.62 x 1.62mm WLCSP and allows you to add a touch-and-swipe interface, wear detection, docking detection and your choice of an inductive waterproof button or the inductive force-sensing features.

Airoha Confirms Bluetooth LE Audio Certification. Chips to Be Available H1 2023

September 19, 2022 by Joao Martins

Airoha Confirms Bluetooth LE Audio Certification. Chips to Be Available H1 2023

Taiwan-based Airoha Technology announced that its new series of Bluetooth audio chips have successfully completed the latest Bluetooth Low Energy Audio Qualification Process and will be "widely available" to manufacturers in the first half of 2023. Airoha is one of the most important suppliers of chips for true wireless earbuds and the LE Audio certification is also an important R&D achievement for its Bluetooth audio R&D team consisted of hundreds of engineers.

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