CEVA Expands Wireless Connectivity Options for Developers with New RivieraWaves UWB Platform

CEVA unveiled its new ultra-low power RivieraWaves UWB platform IP targeting mobile, automotive, consumer and IoT applications, lowering the entry barriers for companies to include UWB in their chip designs. With this new solutions, developers are able to benefit from CEVA's combined IP offering of Bluetooth and UWB technologies for new use cases in emerging high-volume applications.

CEVA announced a new high performance sensor hub DSP architecture designed to handle the broad range of sensor processing and sensor fusion workloads for contextually-aware devices. The new SensPro device family serves as a hub for processing and fusing of data from multiple sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units. This highly-configurable and self-contained architecture brings together scalar and parallel processing for floating point and integer data types, as well as deep learning training and inferencing.

At CES 2020 CEVA unveiled SenslinQ, its first integrated hardware IP and software platform that aggregates sensor fusion, sound and connectivity technologies to enable contextually aware connected devices. The CEVA SenslinQ integrated hardware IP and software platform collects, processes and links data from multiple sensors to enable intelligent devices to understand their surroundings - a key development for augmented hearing using wireless headphones and earbuds.

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.