All items tagged with product development and smartphones (16)

TDK Launches Noise Suppression Filters for Audio Lines of High Sound Quality Devices

November 24, 2023 by Cristina Costa

TDK Launches Noise Suppression Filters for Audio Lines of High Sound Quality Devices

TDK Corporation has announced its latest compact noise suppression filters MAF1005FR series, measuring 1mm (L) x 0.5mm (W) x 0.5mm (H). These multilayer chip components are designed to improve sound quality and reduce noise interference in the audio lines (sound lines) of smartphones, portable devices, and wearables. Mass production of the new EMC components series started in November 2023.

Cirrus Logic Helps Ease PC Industry Transition to New MIPI SoundWire Interface

August 2, 2023 by audioXpress Staff

Cirrus Logic Helps Ease PC Industry Transition to New MIPI SoundWire Interface

Cirrus Logic is offering an advanced audio solution to help ease PC manufacturers' migration to the MIPI SoundWire interface (1.2.1 specification) for a richer, more immersive audio experience. At the heart of the Cirrus Logic advanced, low-power audio solution are the company’s recently announced CS35L56 smart amplifier and CS42L43 Smart HIFI codec that are included in the Intel SoundWire-ready reference design aimed at helping laptop designers make a smooth migration to the new specification.

Elliptic Labs Announces Support for Cirrus Logic Smart Boosted Audio Amplifiers

May 4, 2021 by audioXpress Staff

Elliptic Labs Announces Support for Cirrus Logic Smart Boosted Audio Amplifiers

Elliptic Labs, the innovative Norwegian developer of software sensor solutions, announced a collaboration with Cirrus Logic to certify and optimize Elliptic Labs’ AI Virtual Smart Sensor Platform on Cirrus Logic’s latest smart boosted amplifiers for smartphone, PC/laptop, and IoT customers. Elliptic Labs’ software sensors rely on microphones and speakers to generate and translate ultrasound tones, which benefit from Cirrus Logic new generation audio amplifiers.

Actively Smart True Wireless Earbuds: How to Augment Your Hearing

September 3, 2020 by Joao Martins

Actively Smart True Wireless Earbuds: How to Augment Your Hearing

IFA 2020, in Berlin, Germany, was "the first major global fair for consumer and home electronics" to physically take place since the pandemic. This limited push to promote a trade show again, lead some major consumer electronics companies and brands to converge their announcements in the week from September 1-5, with showcases streamed to the world live from the Berlin exhibition grounds. Some announcements were relevant to the audio industry and included the Qualcomm press conference, which used the opportunity to launch its latest Adaptive ANC platform, an important step towards smart true wireless earbuds.

NXP Enables Industry-First Single Controller for In-Vehicle Multi-Device Wireless Charging

August 28, 2020 by Cristina Costa

NXP Enables Industry-First Single Controller for In-Vehicle Multi-Device Wireless Charging

NXP Semiconductors announced that the first multi-device vehicle wireless charging solution driven by a single MWCT controller is now available in production vehicles. The solution charges two mobile devices simultaneously at up to 2x15 Watts using a single MWCT controller and supports all Qi wireless charging enabled phones including latest iPhone models, and products from Samsung, Huawei and others. Optional NFC is available for convenience features such as BLE/Wi-Fi pairing, smart car access with NFC, in-car purchases and NFC card damage protection.

Murata Develops Compact Multilayer Ceramic Capacitor

June 5, 2020 by audioXpress Staff

Murata Develops Compact Multilayer Ceramic Capacitor

Murata Manufacturing Co., Ltd. has developed the GRM011R60J104M multi-layer ceramic capacitor, which the company claims is the world’s first to feature a maximum capacitance of 0.1µF in 008004 inch size (0.25×0.125mm). Mass production of this new product is scheduled to begin in 2020. Applications can be valuable in wearables devices and compact audio players, among many other products that require large numbers of more compact capacitors.

Cirrus Logic Launches Advanced Haptic and Sensing IC Solutions for Richer, Immersive User Experiences

May 28, 2020 by audioXpress Staff

Cirrus Logic Launches Advanced Haptic and Sensing IC Solutions for Richer, Immersive User Experiences

With the goal of elevating the user experience for a wide range of consumer devices, Cirrus Logic is leveraging its low-power, low-latency mixed-signal processing technology to develop an advanced product portfolio of haptic and sensing integrated circuits (ICs) that enable increased functionality and sleek buttonless designs for smartphones, PCs, wearables, gaming, virtual reality and automotive applications. Cirrus Logic’s haptic products and sophisticated haptic feedback technology enable sleeker, more robust end products with fewer mechanical controls for new responsive and immersive user experiences.

CEVA Announces SensPro High Performance Sensor Hub DSP Architecture for Smart Devices

April 7, 2020 by audioXpress Staff

CEVA Announces SensPro High Performance Sensor Hub DSP Architecture for Smart Devices

CEVA announced a new high performance sensor hub DSP architecture designed to handle the broad range of sensor processing and sensor fusion workloads for contextually-aware devices. The new SensPro device family serves as a hub for processing and fusing of data from multiple sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units. This highly-configurable and self-contained architecture brings together scalar and parallel processing for floating point and integer data types, as well as deep learning training and inferencing.

Waves Expands Collaboration With Qualcomm to Enhance Audio on Next Generation Mobile Devices

March 9, 2020 by audioXpress Staff

Waves Expands Collaboration With Qualcomm to Enhance Audio on Next Generation Mobile Devices

Waves MaxxAudio and Nx 3D audio processing technologies are now compatible with the new Qualcomm Snapdragon 865, 765 and 765G mobile processors targeting the latest smartphones and powering augmented experiences, gaming, and more. These Waves technologies have been until now mainly available on Intel and ARM processor-based platforms. This new combination will allow manufacturers implementing Snapdragon processors in premium smartphones and smart peripherals to also support expanded audio experiences.

TDK Expands PiezoListen Lineup of Ultra-Thin Piezo Speakers with a Wider Dynamic Range

October 29, 2019 by audioXpress Staff

TDK Expands PiezoListen Lineup of Ultra-Thin Piezo Speakers with a Wider Dynamic Range

TDK Corporation has expanded its lineup of ultra-thin PiezoListen speakers with new types featuring a wider dynamic range and higher sound pressure level (SPL) in the low frequency range, even at voltages up to 24 VP-P. The PiezoListen series of piezo speakers now includes the PHUA6630 wide dynamic range speaker with an operating frequency range of 400 Hz to 20 kHz. Also new in the series are two new sound positioning speakers with an operating frequency range of 1000 Hz to 20 kHz.

«
1
2
»