Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

During its Snapdragon Summit 2022, Qualcomm unveiled the latest generation of Snapdragon processors and chips that will power mobile devices, wearables and countless consumer electronics and audio devices to be introduced in 2023. The Snapdragon S5 Gen 2, and the Snapdragon S3 Gen 2 Bluetooth audio chipsets are the evolution from the devices announced in 2022, designed to support Bluetooth LE Audio.

At IFA 2022 in Berlin, Qualcomm Technologies and Bose highlighted their continued collaboration during Cristiano Amon’s opening keynote. Bose is integrating Qualcomm wireless voice and music platforms across their portfolio of premium earbuds, headphones, speakers and soundbars. Qualcomm also confirmed that the new Bose QuietComfort Earbuds II, which are scheduled to be unveiled September 7, will be Powered by the new Qualcomm S5 Sound Platform.

At Mobile World Congress 2022 in Barcelona, Qualcomm announced new options for brands and developers to offer the latest technologies in wireless audio. Qualcomm announced the latest S5 and S3 Sound Platforms with support for new Snapdragon Sound experiences, featuring lossless CD-quality streaming over Bluetooth, stereo recording, ultra-low latency sound with in-game chat, and adaptive active noise cancellation. Both new platforms already offer support for Bluetooth LE Audio.

Qualcomm Technologies International, unveiled the Qualcomm QCC305x SoCs, designed specifically to help brands differentiate across a range of tiers in the very fast-moving truly wireless earbud category. The new SoCs are designed to meet demand for advanced wireless audio use cases, and enable end-to-end support for the new Bluetooth LE Audio standard. The QCC305x series also adds support for ultra-low-power digital ANC technology, Qualcomm Adaptive ANC, Qualcomm TrueWireless Mirroring, and wake word activated voice assistants.

Truly wireless earbuds are growing rapidly in popularity as consumers discover everything that the Apple AirPods and Apple AirPods Pro are capable of and experiment other products, demanding similarly rich functionalities from their devices. To allow manufacturers to stay ahead of the curve by bringing innovative new features to market quickly with Bluetooth 5.2, Qualcomm made available its QCC5141 Occluded Earbud Reference Design with Qualcomm TrueWireless Mirroring and Qualcomm Hybrid ANC.