COMSOL 6 For Speaker Design and Transducer Development Explained!

The AES Audio Product Education Institute (APEI) is presenting a new online event on Wednesday, March 2, exploring the latest updates to the Acoustics Module in COMSOL Multiphysics 6.0 and its possibilities for loudspeaker development. The session, presented by simulation expert Mads Jensen from COMSOL, will detail and explain the significant improvements introduced in the latest version, specifically focusing on transducers and all the great new features for speakers in general.

STMicroelectronics, a leading manufacturer of Micro-Electromechanical Systems (MEMS) technology, announced a collaboration with A*STAR’s Institute of Microelectronics (IME), a research institute in Singapore, and ULVAC, a leading Japanese manufacturing-tool vendor, to jointly setup and operate an 8-inch (200mm) R&D line focused on Piezo MEMS technology within ST’s existing manufacturing facility in Singapore. The concept aims to advance the adoption of piezoelectric MEMS in new applications including augmented reality.

TDK Corporation has expanded its lineup of ultra-thin PiezoListen speakers with new types featuring a wider dynamic range and higher sound pressure level (SPL) in the low frequency range, even at voltages up to 24 VP-P. The PiezoListen series of piezo speakers now includes the PHUA6630 wide dynamic range speaker with an operating frequency range of 400 Hz to 20 kHz. Also new in the series are two new sound positioning speakers with an operating frequency range of 1000 Hz to 20 kHz.

The latest release of COMSOL Multiphysics provides capabilities for building custom simulation applications. With LiveLink for Solidworks and the Application Builder from COMSOL it’s now possible to build applications that integrate simulation and 3D design. The software integrates highly productive model building, app design based on COMSOL models created from a Solidworks software geometry.