All items tagged with product development and personal audio (8)

Sonical Partners with IDUN audio for Embedded Dynamic Spatial Audio

September 13, 2023 by Joao Martins

Sonical Partners with IDUN audio for Embedded Dynamic Spatial Audio

Sonical, the Headphone 3.0 pioneer based in San Mateo, CA, and IDUN audio, the leading-edge startup from Copenhagen, Denmark, specializing in dynamic spatial audio for headphones, have formalized a strategic partnership. The two companies have been cooperating since 2022, and IDUN audio was part of the Sonical CES 2023 demos, with its dynamic spatial audio software running on Sonical's headphone operating system CosmOS - enabling unsurpassed spatialization with fast head tracking.

Audio Pioneer xMEMS Promotes Seminar Series: xMEMS Live – China 2023

September 12, 2023 by audioXpress Staff

Audio Pioneer xMEMS Promotes Seminar Series: xMEMS Live – China 2023

Semiconductor pioneer xMEMS Labs announced the launch of xMEMS Live – China 2023, a two-day seminar aimed at demonstrating the company's technology for Chinese consumer tech and audio brands through product demos, keynotes and in-depth tech-talk presentations. The seminars will take place September 18 at the Renaissance Caohejing Hotel in Shanghai, and on September 20 at the Westin Nanshan in Shenzhen. The seminar signal xMEMS significant expansion throughout Asia, North America, and Europe.

Skullcandy's New Under $100 True Wireless Earbuds Offer Skull-iQ Smart Feature Technology

September 29, 2021 by audioXpress Staff

Skullcandy's New Under $100 True Wireless Earbuds Offer Skull-iQ Smart Feature Technology

True wireless earbuds that offer truly differentiated features, such as hands-free control via simple voice commands, personal audio profiles, and software updates, are now a reality under $100. Coming from Skullcandy, the popular headphone brand leading that price category, the new Grind Fuel and Push Active TWS designs offer those features thanks to Bragi OS, and over 18 months of development effort by the Skullcandy and Bragi teams.

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

September 22, 2020 by audioXpress Staff

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

In the wake of the acquisition of the Hillcrest Laboratories (Hillcrest Labs) business from InterDigital in mid-2019, CEVA now introduced the Hillcrest Labs MotionEngine Hear, a sensor and processor agnostic embedded software solution for hearable devices. The new solution allows SoC vendors, OEMs and ODMs to take advantage of a configurable sensor fusion platform to add intuitive user interface, gesture control, activity tracking and spatial audio capabilities to hearable devices.

Next-Generation SIMO Power Management IC from Maxim Integrated Extends Battery Life for Wearables and Hearables

April 7, 2020 by audioXpress Staff

Next-Generation SIMO Power Management IC from Maxim Integrated Extends Battery Life for Wearables and Hearables

Designers of compact consumer devices like hearables can now slash solution size by half and extend battery life by 20 percent with the MAX77654 single inductor, multiple output (SIMO) power management IC (PMIC) from Maxim Integrated Products. The breakthrough new SIMO technology replaces traditional power management architectures for the most demanding designs in wearables and personal audio devices, reducing BOM count by up to 40 percent, with 23 percent lower BOM cost compared to discrete solutions.

Dirac and RHA Announce Commitment to Explore Next-Generation of Headphone Sound

September 26, 2019 by audioXpress Staff

Dirac and RHA Announce Commitment to Explore Next-Generation of Headphone Sound

Sound processing pioneer Dirac announced a commercial agreement with RHA to explore the integration of Dirac’s latest audio algorithms into the British manufacturer's headphones. According to the Swedish company, "the collaboration with RHA marks an important step for Dirac as it establishes itself as a global leader in digital sound optimization solutions for the headphone market – as it has for the luxury automotive, home theater, and mobile markets." RHA says this relationship with Dirac reinforces the company’s mission to deliver the best possible audio quality.

DSP Concepts and CEVA Partner to Streamline Audio/Voice DSP Software Development for High-End Sound Applications

July 19, 2019 by audioXpress Staff

DSP Concepts and CEVA Partner to Streamline Audio/Voice DSP Software Development for High-End Sound Applications

CEVA and DSP Concepts announced that DSP Concepts’ industry-leading Audio Weaver tools and TalkTo voice front-end now support the CEVA-X2 and CEVA-BX family of DSPs. Audio Weaver is already being used by a number of companies who are leveraging the design tool to develop advanced audio and voice applications for their CEVA DSP based designs.

Cypress Low-Power Bluetooth MCUs Extend Range and Battery Life in Voice and Audio Applications

April 15, 2019 by audioXpress Staff

Cypress Low-Power Bluetooth MCUs Extend Range and Battery Life in Voice and Audio Applications

Cypress Semiconductor announced two low-power, dual-mode Bluetooth 5.0 and Bluetooth Low Energy (BLE) microcontrollers (MCUs) that include support for Bluetooth mesh networking, and provide simultaneous Bluetooth 5.0 audio and BLE connections, delivering low-power wireless solutions that enable music and voice commands for battery-powered personal devices. With the new CYW20819 and CYW20820 MCUs, designers can also develop low-cost, low-power Bluetooth mesh network devices.