Dialog Semiconductor Provides Audio and Configurable Mixed Signal Chipset for Huawei Honor FlyPods

Dialog Semiconductor announced that its audio and Configurable Mixed Signal ICs (CMICs) have been adopted by Huawei for their Honor FlyPods, the company’s latest True Wireless Stereo (TWS) earbuds. Five Dialog ICs provide voice control and power to Huawei’s recently announced TWS earbuds. A Dialog’s SmartBeat DA14195 System-on-Chip (SoC) is integrated into each FlyPod earbud and is connected to a pair of Voice Pick Up (VPU) sensors.

Qualcomm Technologies International, a subsidiary of Qualcomm Incorporated, showcased at MWC 2019 in Barcelona the most recent wireless earbuds and hearables using the latest Qualcomm QCC5100 and QCC302x series, ultra-low power Bluetooth audio SoCs. Now available in more than 10 products, Qualcomm is finding increased traction from audio, mobile and consumer electronics manufacturers for these SoCs, allowing for a robust, low-latency and high-quality wireless audio experiences, in compact, feature-rich wireless earbuds, headsets and speakers.

Nanusens, a research venture working on nano-sensors built inside CMOS devices, has announced that its proprietary technology can significantly increase the operational life of earbuds by up to 20%. This can be achieved by replacing the MEMS sensors in an earbud with a single multi-sensor chip solution that is up to ten times smaller, freeing up space for larger batteries. The company will be announcing this technology solution at MWC 2019 in Barcelona, Spain.