All items tagged with product development and machine learning (42)

Silicon Labs Introduces BG22L and BG24L "Lite" Bluetooth LE SoCs

January 31, 2025 by audioXpress Staff

Silicon Labs Introduces BG22L and BG24L "Lite" Bluetooth LE SoCs

Silicon Labs introduced the BG22L and BG24L SoCs for Bluetooth LE connectivity, with "L" representing the new application-optimized Lite devices. These new ultra-low power Bluetooth devices are optimized for applications like asset tracking tags, remote control, and small appliances. The BG22L delivers robust security and processing for common Bluetooth devices, while BG24L supports advanced AI/ML acceleration and Channel Sounding.

Upgraded Sensor Board from STMicroelectronics Accelerates Plug-and-Play Evaluation with ST MEMS Studio

January 28, 2025 by Cristina Costa

Upgraded Sensor Board from STMicroelectronics Accelerates Plug-and-Play Evaluation with ST MEMS Studio

Developing context-aware applications with MEMS sensors is faster, more powerful, and more flexible with ST’s latest-generation sensor evaluation board, the STEVAL-MKI109D. Now upgraded with an STM32H5 microcontroller, USB-C connector, and extra digital interfaces including I3C for flexible communication, the new board lets users quickly evaluate sensors and confidently handle demanding projects with a convenient, graphical development environment.

Ceva and Edge Impulse Join Forces to Enable Faster Development of Edge AI Applications

September 24, 2024 by audioXpress Staff

Ceva and Edge Impulse Join Forces to Enable Faster Development of Edge AI Applications

Ceva and Edge Impulse announced a collaboration to rapidly develop, train and deploy advanced embedded machine learning (ML) applications on Ceva's neural processing units with cycle-accurate performance, even before physical hardware is available. This first-of-its-kind collaboration based around Ceva's NPU IP ensures that developers can accurately benchmark and refine the performance of their edge AI models using Edge Impulse's platform, significantly accelerating the time-to-market.

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

Microchip Technology Launches RISC-V Multi-Core 64-Bit Microprocessors

July 10, 2024 by Cristina Costa

Microchip Technology Launches RISC-V Multi-Core 64-Bit Microprocessors

Real-time, compute intensive applications such as fully adaptive noise cancellation, voice separation and Machine Learning (ML) are pushing the boundaries of embedded processing requirements, demanding more power-efficiency, hardware-level security and high reliability at the edge. With the launch of its PIC64 portfolio, Microchip Technology expanded its computing range to meet this rising demands.

New Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms Dramatically Expand Options for Mid-Tier Designs

March 26, 2024 by Joao Martins

New Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms Dramatically Expand Options for Mid-Tier Designs

Qualcomm Technologies International announced the new Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms, designed to allow OEMs deliver sound experiences never before possible at the S5 and S3 tiers. All Gen 3 devices support Bluetooth LE Audio and Auracast. The mid-tier S3 Gen 3 Sound Platform now allows customizations via 3rd party solutions from the Qualcomm Voice & Music Extension Program. And now there is a new quality option with aptX Lossless at 24-bit/48kHz.

Ambiq Removes Noise in Real-Time with Speech Enhancement AI for Connected Applications

August 29, 2023 by Joao Martins

Ambiq Removes Noise in Real-Time with Speech Enhancement AI for Connected Applications

Ambiq introduced the Neural Network Speech Enhancer (NNSE), the latest addition to its neuralSPOT's Model Zoo - a highly optimized AI model that effectively removes background noise from speech on the device in real-time, allowing clean speech capture in noisy environments. As with all Ambiq Model Zoo components, NNSE includes scripts and tools to help developers add speech de-noising capabilities to their applications.

CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family

August 18, 2023 by audioXpress Staff

CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family

CEVA announced its enhanced NeuPro-M NPU family, directly addressing the processing needs of the next era of Generative AI with industry-leading performance and power efficiency for any AI inferencing workload, from cloud to the edge. The new NeuPro-M processor family delivers an industry leading 350 TOPS/Watt to bring the power of generative AI to any application, including for consumer and mobile markets, with exceptional cost and power efficiency.

TDK Redefines True Wireless Stereo Applications with VibeSense360 Solution Suite

May 4, 2023 by Joao Martins

TDK Redefines True Wireless Stereo Applications with VibeSense360 Solution Suite

TDK Corporation announced the availability of its InvenSense VibeSense360 TWS solution suite, previewed at CES 2023. VibeSense360 is a comprehensive portfolio of TDK hardware and software solutions designed to help solve some of the most complicated problems OEMs face when designing true wireless stereo (TWS) products with state-of-the-art features. On the hardware VibeSense360 includes the TWS-M601 6-axis IMU, and the TWS-M602 device, combining IMU, accelerometer and machine learning on-chip.

STMicroelectronics Unveils World’s First MCU Edge-AI Developer Cloud

February 2, 2023 by Cristina Costa

STMicroelectronics Unveils World’s First MCU Edge-AI Developer Cloud

STMicroelectronics continues to expand its solutions for embedded AI developers and data scientists with a new, industry-first set of tools and services to get edge AI technology on the market faster and with less complexity by aiding hardware and software decision-making. The STM32Cube.AI Developer Cloud opens access to an extensive suite of online development tools built around the industry-leading STM32 family of microcontrollers (MCUs). Benefits include access to online service to benchmark edge-AI models on STM32 boards.

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