The Future of Seamless Audio According to Qualcomm

An exclusive interview with Dino Bekis, Qualcomm's Vice President and General Manager, Wearables & Mixed Signal Solutions Business Unit, where he shares fascinating insights into the company's roadmap and future developments, leveraging the best of Bluetooth and Wi-Fi in wireless earbuds and headphones into a seamless, high-quality audio experience. We also learn about Qualcomm's unique vision for its latest generation Snapdragon Sound platforms, and XPAN technology, allowing wireless hi-res audio without bandwidth constraints or compromising battery life.

During its Snapdragon Summit event Qualcomm unveiled the latest S7 and S7 Pro Gen1 Sound platforms, which will soon power a new generation of advanced audio products. The new platforms offer five times the compute power, three times the DSP processing power, and almost 100 times on-device AI processing power compared to the previous generation. A real differentiator is the use of micro-power Wi-Fi to extend wireless audio range and support for up to 192kHz lossless music quality in the S7 Pro.