All items tagged with product development and LE Audio (18)

Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast

March 11, 2025 by Joao Martins

Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast

Synaptics has extended its Veros Triple Combo connectivity portfolio with the launch of the latest SYN461x family of ultra-low-power Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0, Bluetooth LE Audio with Auracast, and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for embedded applications in Edge AI connected devices, the Veros SYN461x family is optimized for system integration, size, and rapid time to market.

Cloud2GND Bumblebee Bluetooth LE Audio Demonstration Board

February 21, 2024 by Joao Martins

Cloud2GND Bumblebee Bluetooth LE Audio Demonstration Board

Cloud2GND, an engineering house specializing in electronic circuit design, embedded systems, protocols, and connected devices developed the Bumblebee LE Audio Demonstrator, the first chipmaker-independent platform for product developers to test and evaluate Bluetooth LE Audio and Auracast applications. Featuring the Panasonic PAN1783 Bluetooth Low Energy 5.3 module, the board is a ready-to-use platform with a class-D amplifier, AKM stereo ADC/DAC, MEMS microphone, NFC and is powered over USB or external power supply.

Ceva Brings Bluetooth Audio to Sunplus airlyra SoC Family

January 15, 2024 by audioXpress Staff

Ceva Brings Bluetooth Audio to Sunplus airlyra SoC Family

Ceva and Sunplus Technology, a leading chip provider for multimedia and automotive applications, have expanded their collaboration to integrate Ceva's latest generation RivieraWaves Bluetooth audio solution into the Sunplus airlyra family of HD audio processors targeting wireless speakers, soundbars and other premium wireless audio devices. The first wireless airlyra processors are already shipping with some of the world's premium audio brands.

Packetcraft Introduces Wireless Multi-Microphone Demo Kit based on Bluetooth LE Audio to Accelerate New Category of Peripherals

January 8, 2024 by Joao Martins

Packetcraft Introduces Wireless Multi-Microphone Demo Kit based on Bluetooth LE Audio to Accelerate New Category of Peripherals

At CES 2024, Packetcraft announced a new Wireless Multi-Microphone Demo Kit based on Bluetooth LE Audio technology that incorporates the company’s newly available Link Robustness Package. Packetcraft’s software solution supports a new standards-based ultra-low latency solution for wireless microphone accessories. These can typically be integrated into mobile devices and computers, in addition to supporting specialized commercial audio applications, voice announcement systems, and conference room wireless microphones.

Qualcomm Extends S3 Gen 2 Sound Platform Portfolio to Deliver Best-In-Class Gaming and LE Audio Experiences

June 21, 2023 by audioXpress Staff

Qualcomm Extends S3 Gen 2 Sound Platform Portfolio to Deliver Best-In-Class Gaming and LE Audio Experiences

Qualcomm Technologies International unveiled an addition to the Qualcomm S3 Gen 2 Sound platform portfolio. This newly enhanced solution is optimized for gaming and ready for use in dongles and adapters. It combines Snapdragon Sound and LE Audio to deliver ultra-low latency of less than 20ms for lag-free wireless audio with voice back-channel for in-game chat. When delivering game audio only, the latency is further reduced.

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

June 27, 2022 by Joao Martins

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

Nordic Semiconductor has used the latest trade shows globally to showcase its latest low power wireless solutions, and introduced a series of new development solutions targeting Bluetooth LE Audio. At the Embedded World Exhibition that took place in Nuremberg, Germany, Nordic offered demonstrations of its new nRF5340 Audio Development Kit (DK), a design platform for rapid development of LE Audio products, and the Nordic Thingy:53 a rapid prototyping solution, both based on Nordic’s nRF5340 SoC.

Packetcraft Announces Auracast Broadcast Audio Bluetooth Software Availability

June 9, 2022 by audioXpress Staff

Packetcraft Announces Auracast Broadcast Audio Bluetooth Software Availability

Packetcraft, the wireless software licensor, announced that its Bluetooth LE Audio software achieved qualification from the Bluetooth SIG enabling developers to quickly refresh products with support for audio sharing, including the recently announced Auracast broadcast audio. The company is already providing commercial licensees with Bluetooth SIG qualified LE Audio software supporting the Bluetooth Low Energy (LE) Generic Audio Framework specifications.

CEVA Bluetooth 5.3 Platform IP Supports New Auracast Broadcast Audio

June 8, 2022 by audioXpress Staff

CEVA Bluetooth 5.3 Platform IP Supports New Auracast Broadcast Audio

CEVA announced that its latest RivieraWaves Bluetooth 5.3 IP family now supports Auracast broadcast audio, the new audio sharing standard, based on the Bluetooth LE Audio broadcasting specification, unveiled by the Bluetooth Special Interest Group (SIG). According to CEVA, Auracast broadcast audio is set to transform the shared audio experience, enabling an unlimited number of Auracast receiver-compliant devices such as TWS earbuds, headphones, hearing aids and wireless speakers to simultaneously receive audio broadcast from one or several Auracast transmitter devices.

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

February 3, 2022 by Joao Martins

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

Synaptics announced the SYN4381 Triple Combo system-on-chip (SoC), the first to combine Wi-Fi 6/6E (802.11ax with extended 6 GHz operation), Bluetooth 5.2 (BT 5.2) with BLE Audio and High Accuracy Distance Measurement (HADM), and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer. The solution simplifies product development while supporting 600 Mbps video and data, low-power Thread communication, and platform-agnostic device setup and interoperability.

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

January 13, 2022 by Joao Martins

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

NXP Semiconductors announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2 and 802.15.4 (Zigbee, Thread, Z-Wave, Matter) protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive and industrial use cases. The single SoC enables simultaneous transmit and receive for higher performance in smart solutions, and supports Matter, the new interoperable, secure connectivity standard for the smart home.

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