The Future of Seamless Audio According to Qualcomm

An exclusive interview with Dino Bekis, Qualcomm's Vice President and General Manager, Wearables & Mixed Signal Solutions Business Unit, where he shares fascinating insights into the company's roadmap and future developments, leveraging the best of Bluetooth and Wi-Fi in wireless earbuds and headphones into a seamless, high-quality audio experience. We also learn about Qualcomm's unique vision for its latest generation Snapdragon Sound platforms, and XPAN technology, allowing wireless hi-res audio without bandwidth constraints or compromising battery life.

Qualcomm Technologies International announced the new Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms, designed to allow OEMs deliver sound experiences never before possible at the S5 and S3 tiers. All Gen 3 devices support Bluetooth LE Audio and Auracast. The mid-tier S3 Gen 3 Sound Platform now allows customizations via 3rd party solutions from the Qualcomm Voice & Music Extension Program. And now there is a new quality option with aptX Lossless at 24-bit/48kHz.