All items tagged with product development and hybrid ANC (8)

Analog Devices Presents New-Generation ADAU1797 Low Power Audio Processor at CES 2024

January 9, 2024 by Joao Martins

Analog Devices Presents New-Generation ADAU1797 Low Power Audio Processor at CES 2024

Analog Devices is now sampling its latest audio processor and low power ANC codec, the ADAU1797. This high-performance device with integrated HiFi 3z and FastDSP cores is able to efficiently support front-end audio processing with beamforming and noise reduction, as well as neural network-assisted speech recognition (ASR) processing. An ideal, low latency, low power, three times more powerful processor for true wireless stereo (TWS) ANC earbuds and headphones.

Orosound Labs Innovation Division Accelerates AI-Enabled Hearables

January 5, 2024 by Joao Martins

Orosound Labs Innovation Division Accelerates AI-Enabled Hearables

Orosound, a company with patented signal processing and noise-canceling technologies, has unveiled Orosound Labs, its advanced innovation division that has operated sub rosa for the last couple of years. As the company stands at the forefront of AI-enabled active noise cancellation and reduction technologies that are ready to be embedded in consumer brand products, Orosound Labs is committed to empowering partners with a faster and more reliable way to introduce hearables with unique AI features to the market.

Everything That's Audio in audioXpress December 2023

November 14, 2023 by audioXpress Staff

Everything That's Audio in audioXpress December 2023

audioXpress December 2023 includes a market overview of multiroom audio, Brent Butterworth writes about new ways to measure ANC earbuds, and Stuart Yaniger measured the new Axign and GaN Systems Class-D audio amplifier board. Richard Honeycutt writes about tubes, BJTs, JFETs, MOSFETs, and ICs, and Dimitri Danyuk, discusses JFETs in audio circuits. Douglas Self explains how to optimize variable-frequency tone controls, and Jan Didden shares his eDD direct-drive amplifier project.

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

January 9, 2023 by Joao Martins

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

Part of xMEMS Labs announcements at CES 2023, the innovative MEMS speaker company introduced Skyline, the world’s first discrete solid-state MEMS DynamicVent, a specific design with a valve that opens or closes by sensor fusion input from the earbud DSP and enables the benefits of both an open-fit (spatially aware) and closed-fit (occluded) earbud design. This enables smart TWS earbuds and hearing aids that create best-of-both-worlds user experiences in the same product.

Synaptics Announces AudioSmart AS33970 Edge AI Headset Platform

October 18, 2021 by audioXpress Staff

Synaptics Announces AudioSmart AS33970 Edge AI Headset Platform

Synaptics announced its newest AudioSmart AS33970 headset platform SoC, directly targeting the fastest growing product categories, from work-from-anywhere TWS earbuds to hearables. As the San Jose, California-based company details, the new SoC offers the world’s first highly integrated AI-enabled ENC (Environmental Noise Cancellation) and hybrid ANC (Active Noise Cancellation) single-chip solution integrating neural and voice processing engines for optimal audio performance.

Qualcomm Announces QCC5141 Occluded Earbud Reference Design Platform to Simplify True Wireless Development

November 11, 2020 by Joao Martins

Qualcomm Announces QCC5141 Occluded Earbud Reference Design Platform to Simplify True Wireless Development

Truly wireless earbuds are growing rapidly in popularity as consumers discover everything that the Apple AirPods and Apple AirPods Pro are capable of and experiment other products, demanding similarly rich functionalities from their devices. To allow manufacturers to stay ahead of the curve by bringing innovative new features to market quickly with Bluetooth 5.2, Qualcomm made available its QCC5141 Occluded Earbud Reference Design with Qualcomm TrueWireless Mirroring and Qualcomm Hybrid ANC.

Qualcomm Offers New Ultra-Low Power Bluetooth Audio SoCs for Truly Wireless ANC Development

March 26, 2020 by audioXpress Staff

Qualcomm Offers New Ultra-Low Power Bluetooth Audio SoCs for Truly Wireless ANC Development

With its previous generation of QCC SoCs for Bluetooth true wireless earbuds development, Qualcomm enabled virtually every single mobile and CE brand to finally create products able to compete with Apple's massively successful AirPods, still the market leader by a wide margin. Then Apple introduced its AirPods Pro with ANC and its market share expanded even more. Now Qualcomm launched a new generation of SoCs combining hybrid ANC and other technologies to enable brands to design new competitive TWS products.

Dialog Semiconductor Launches Family of Audio Codecs Delivering Superior Active Noise Cancellation

May 30, 2019 by audioXpress Staff

Dialog Semiconductor Launches Family of Audio Codecs Delivering Superior Active Noise Cancellation

Dialog Semiconductor announced the DA740x, a family of highly-integrated audio codec chips that deliver best-in-class active noise cancellation (ANC), providing optimal audio performance in any environment to the rapidly-growing wireless headphones market. According to the British semiconductor company, the DA740x chips are able to deliver superior active noise cancellation – no matter how noisy the environment – with twice the audio quality and half the power consumption as competitive solutions.