All items tagged with product development and home automation (7)

Texas Instruments Unifies Smart Home Connected Ecosystems with Matter-Enabled SimpleLink Wireless MCUs

November 22, 2022 by Cristina Costa

Texas Instruments Unifies Smart Home Connected Ecosystems with Matter-Enabled SimpleLink Wireless MCUs

Enabling smarter connections to the world around us, Texas Instruments (TI) introduced new Matter-enabled software development kits for Wi-Fi and Thread SimpleLink wireless microcontrollers (MCUs) that will streamline adoption of the Matter protocol in connected applications (also named sometimes as Internet of Things or IoT). The software builds on TI’s close involvement with the Connectivity Standards Alliance and innovation in the 2.4-GHz connectivity space.

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

January 28, 2022 by audioXpress Staff

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

Wireless connectivity specialists Telit announced the launch of their new WE310G4 module, which enables manufacturers to add dual-band Wi-Fi and Bluetooth Low Energy (BLE) 5.0 connectivity quickly and cost-effectively to their products. Based on Realtek's Ameba system on chip (SoC), the WE310G4 is ideal for a wide variety of embedded designs, including smart home devices and appliances, wearables, fitness trackers, smart city sensors, aftermarket telematics and industrial automation sensors.

STMicroelectronics Introduces BlueNRG-MESH Bluetooth Mesh Networking Software Development Kit

September 27, 2017 by audioXpress Staff

STMicroelectronics Introduces BlueNRG-MESH Bluetooth Mesh Networking Software Development Kit

STMicroelectronics is empowering the next wave of control-by-phone innovation with new software for creating smart objects that connect using the latest Bluetooth wireless networking features. The company announced an all-in-one software package that enables creation of networked smart objects and accompanying mobile apps with support for the official Bluetooth SIG Mesh-networking specification, assuring end-product interoperability, enhancing ease of use, and market appeal

3PASS flex: New Background Noise Simulation System for Multi-Microphone Arrangements

April 11, 2017 by audioXpress Staff

3PASS flex: New Background Noise Simulation System for Multi-Microphone Arrangements

3PASS flex is HEAD acoustics new simulation system for measuring speech quality performance in the presence of background noise. It is particularly suited for testing multi-microphone systems, microphone arrays or beamforming microphones in real world conditions where multi-point noise simulation with flexible microphone and loudspeaker arrays is required. 3PASS flex reproduces any previously recorded sound field at distinct microphone positions, representative of typical use cases.

Nordic Semiconductor to Demonstrate Bluetooth 5 Enhancements at CES 2017

December 27, 2016 by Cristina Costa

Nordic Semiconductor to Demonstrate Bluetooth 5 Enhancements at CES 2017

Nordic Semiconductor in collaboration with its design partners are unveiling latest Bluetooth low energy and IEEE 802.15.4-enabled innovations at International CES 2017 in Las Vegas. The Norwegian company will demonstrate the capabilities of its Bluetooth 5-compatible nRF52 Series SoCs. Product demonstrations include contactless payment, wearables wireless charging, thread networking, voice-activated remote control, educational platforms, home automation and Bluetooth 5 enhancements.

STMicroelectronics Introduces STM32H7 MCU Series with Increased Performance for Smart Devices

October 21, 2016 by Cristina Costa

STMicroelectronics Introduces STM32H7 MCU Series with Increased Performance for Smart Devices

STMicroelectronics is paving the way to even more intelligent smart devices everywhere with its new record-breaking STM32H7 series of microcontrollers, which embeds the highest SRAM memory (1Mbytes), Flash memory up to 2MB, and the richest connectivity peripheral set ever seen in the STM32 platform. Apart from extremely high on-chip memory density, the new STM32H7 series features state-of-the-art security for connected objects.

The Future in Product Development at electronica 2016

October 10, 2016 by audioXpress Staff

The Future in Product Development at electronica 2016

Anyone involved in product development, design, and production needs to attend the electronica 2016 trade-show, November 8-11. The 27th International Trade Fair for Electronic Components, Systems and Applications, will be the largest ever, featuring an additional hall to occupy a total of 13 halls at the Messe München trade-fair center, and offering even more presentations on current industry trends, such as embedded systems, connectivity, automotive electronics, home automation, smart grids, and IoT.