Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP

The Fraunhofer Institute for Integrated Circuits (IIS), headquartered in Erlangen, Germany, and Tymphany have partnered to provide state-of-the-art spatial audio solutions to audio manufacturers. The two companies have worked together to integrate Fraunhofer's audio processing suites and audio technologies into Flow DSP, Tymphany's own DSP platform and design framework which allows creating immersive audio features in new audio products.

TDK Corporation announced the availability of its InvenSense VibeSense360 TWS solution suite, previewed at CES 2023. VibeSense360 is a comprehensive portfolio of TDK hardware and software solutions designed to help solve some of the most complicated problems OEMs face when designing true wireless stereo (TWS) products with state-of-the-art features. On the hardware VibeSense360 includes the TWS-M601 6-axis IMU, and the TWS-M602 device, combining IMU, accelerometer and machine learning on-chip.

During its Snapdragon Summit 2022, Qualcomm unveiled the latest generation of Snapdragon processors and chips that will power mobile devices, wearables and countless consumer electronics and audio devices to be introduced in 2023. The Snapdragon S5 Gen 2, and the Snapdragon S3 Gen 2 Bluetooth audio chipsets are the evolution from the devices announced in 2022, designed to support Bluetooth LE Audio.

Demand for True Wireless Stereo (TWS) products reflect the growing demand for multi-function, health care, and connected wearable solutions, all requiring smaller and longer battery life devices. Asahi Kasei Microdevices (AKM) has recently introduced the AKM AK4336ECB ultra low power audio codec, a 4-channel ADC and one channel DAC that supports active noise cancelling designs, complementing its complete portfolio of audio systems and sensors for TWS development.

Cadence Design Systems and Waves Audio announced the availability of the Waves Nx Virtual Reality Audio Technology on the Cadence Tensilica HiFi 3 DSP for Audio, Voice, and Speech. The Waves Nx solution, which delivers high-quality VR audio and true 5.1 or 7.1 surround with a minimal resource footprint, will be demonstrated at the Cadence booth at Mobile World Congress in Barcelona, February 27 to March 2, 2017, in Hall 6, Stand 6L36.