Sonical Partners with IDUN audio for Embedded Dynamic Spatial Audio

Sonical, the Headphone 3.0 pioneer based in San Mateo, CA, and IDUN audio, the leading-edge startup from Copenhagen, Denmark, specializing in dynamic spatial audio for headphones, have formalized a strategic partnership. The two companies have been cooperating since 2022, and IDUN audio was part of the Sonical CES 2023 demos, with its dynamic spatial audio software running on Sonical's headphone operating system CosmOS - enabling unsurpassed spatialization with fast head tracking.

STMicroelectronics has announced the LSM6DSV16BX, a unique highly integrated sensor that delivers important space savings inside hearable devices or general-purpose TWS earbuds, including for sports. The new device delivers longer listening experiences and superior hearing by combining a 6-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1KHz.

DSP Concepts announced that its Audio Weaver development platform for audio products now also offers access to the Fraunhofer Cingo family of immersive processing tools. The agreement with Fraunhofer IIS allows audio product developers to enhance headphones, earbuds and speakers with binaural audio processing for immersive 3D sound with head tracking, as well as enhance existing stereo content, including loudness optimization and equalization. Cingo supports all channel-based formats and direct rendering of audio objects with associated position metadata, which can be transmitted as MPEG-H Audio.

CEVA announced an expansion to its family of sensor fusion products with the introduction of the FSP201, a high-performance and low-power sensor hub MCU that delivers precise, accurate sensor fusion for motion tracking, heading and orientation detection. The FSP201 is ideal for consumer robotics and other emerging smart devices employing sensor fusion technologies, including XR glasses, 3D audio headsets and the wide range of 6-axis motion use cases across IoT and the metaverse.

Immersive 3D/spatial audio - combined with XR/360 video - can transport you away from your home and into the middle of a lush forest with the sound of twigs crunching below you, a deer running off in the East, and the flapping of wings as your eyes follow a cardinal flying away. Accurate head tracking helps deliver a true-to-life user experience (UX), and understanding which factors are key in evaluating a solution will help you navigate this growing industry.

CEVA and VisiSonics, a developer of patented 3D spatial audio technologies, announced that the companies have collaborated closely together to develop a comprehensive 3D spatial audio solution for embedded devices, including true wireless audio (TWS) earbuds, headphones and other hearables. The collaboration combines VisiSonics' RealSpace 3D audio software optimized for CEVA’s low power audio and sensor hub DSPs together with CEVA’s MotionEngine head tracking algorithms running on its BNO080 9-axis System in Package (SiP).