Grinn Unveils AstraSOM-1680 Edge AI Module

Grinn, an electronics design and engineering development house, announced the launch of its latest System on Module, the Grinn AstraSOM-1680, powered by the advanced Synaptics Astra SL1680 embedded processor. The Grinn AstraSOM-1680 is a compact, high-performance module designed to bring new capabilities to edge devices, enabling smart camera applications and AI-intensive applications such as Natural Language Processing.

InnoPhase IoT, a semiconductor company specializing in ultra-low power Wi-Fi, and GreenWaves Technologies, the company pioneering ultra-low power AI and DSP processors for hearables and connected devices, announced the development of a lossless audio reference design for Wi-Fi headphones. In collaboration with Danish pioneer IDUN Audio, InnoPhase and GreenWaves have created a platform that enables Spatial Audio for hearables and headphones with extended range and long battery life.

With a focus on a modern, AI-assisted, user experience, Siemens Digital Industries Software announced the next generation release of its Xpedition electronic systems design software that simplifies complex PCB design processes, and aims to reduce learning curves, and accelerate productivity. This release combines Xpedition, Hyperlynx and PADS Professional software through a unified user experience with cloud connectivity and collaboration. The update also adds enhanced integration with Siemens’ Teamcenter and NX Software.

The nRF54L wireless SoCs are one of the biggest product launches of the electronica 2024 show in Munich, and they redefine once again Nordic Semiconductor’s lead in ultra-low power wireless for connected devices. The new nRF54L Series includes the previously announced nRF54L15, and the new nRF54L10 and nRF54L05 wireless SoCs. This advanced product series offers significantly enhanced efficiency, exceptional processing power, and versatile design options to meet a growing range of Bluetooth LE applications, including LE Audio and Auracast products.