All items tagged with product development and edge AI (54)

Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast

March 11, 2025 by Joao Martins

Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast

Synaptics has extended its Veros Triple Combo connectivity portfolio with the launch of the latest SYN461x family of ultra-low-power Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0, Bluetooth LE Audio with Auracast, and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for embedded applications in Edge AI connected devices, the Veros SYN461x family is optimized for system integration, size, and rapid time to market.

Synaptics Brings Astra AI-Native Platform to CES 2025

December 18, 2024 by Joao Martins

Synaptics Brings Astra AI-Native Platform to CES 2025

Following earlier demonstrations at trade shows all over the world, Synaptics will showcase its Astra AI-Native processing and Veros intelligent connectivity offerings at CES 2025. Synaptics Astra AI-native platform showcases the advantages of purpose-built hardware paired with an open-source development framework, and intelligent connectivity to enable rapid development of context-aware connected devices.

AONDevices Unveils Edge AI Sensor Module in Collaboration with P-Logic Consulting

December 16, 2024 by Joao Martins

AONDevices Unveils Edge AI Sensor Module in Collaboration with P-Logic Consulting

AONDevices announced the launch of its AONix Edge AI sensor module, a new platform that addresses key challenges for battery-operated connected devices running artificial intelligence on the edge. Developed in collaboration with P-Logic Consulting and featuring sensor integration from TDK InvenSense, this compact 32mm x 32mm module is an energy-efficient platform with the ability to deliver real-time AI performance in always-on applications, particularly for consumer electronics.

STMicroelectronics Introduces First STM32 Wireless Module Leveraging Collaboration with Qualcomm

December 10, 2024 by Cristina Costa

STMicroelectronics Introduces First STM32 Wireless Module Leveraging Collaboration with Qualcomm

STMicroelectronics introduced the first result of its strategic collaboration with Qualcomm Technologies to simplify development of next-generation STM32-based wireless solutions. The new ST67W611M1 modules combine Wi-Fi6, Bluetooth 5.3 and Thread connectivity to accelerate development of advanced consumer wireless solutions. Applications in home audio and smart home, powered by edge AI are a natural use case.

Grinn Unveils AstraSOM-1680 Edge AI Module

December 4, 2024 by Joao Martins

Grinn Unveils AstraSOM-1680 Edge AI Module

Grinn, an electronics design and engineering development house, announced the launch of its latest System on Module, the Grinn AstraSOM-1680, powered by the advanced Synaptics Astra SL1680 embedded processor. The Grinn AstraSOM-1680 is a compact, high-performance module designed to bring new capabilities to edge devices, enabling smart camera applications and AI-intensive applications such as Natural Language Processing.

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

October 1, 2024 by Cristina Costa

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

STMicroelectronics and Qualcomm Technologies International, announces a new strategic collaboration for the next generation of industrial and consumer connected solutions augmented by edge AI. The collaboration will pair STMicroelectronics' STM32 microcontroller ecosystem and Qualcomm's wireless connectivity solutions to allow simple, fast, and cost-effective designs of next-generation connected applications.

Ceva and Edge Impulse Join Forces to Enable Faster Development of Edge AI Applications

September 24, 2024 by audioXpress Staff

Ceva and Edge Impulse Join Forces to Enable Faster Development of Edge AI Applications

Ceva and Edge Impulse announced a collaboration to rapidly develop, train and deploy advanced embedded machine learning (ML) applications on Ceva's neural processing units with cycle-accurate performance, even before physical hardware is available. This first-of-its-kind collaboration based around Ceva's NPU IP ensures that developers can accurately benchmark and refine the performance of their edge AI models using Edge Impulse's platform, significantly accelerating the time-to-market.

Microchip Technology Launches RISC-V Multi-Core 64-Bit Microprocessors

July 10, 2024 by Cristina Costa

Microchip Technology Launches RISC-V Multi-Core 64-Bit Microprocessors

Real-time, compute intensive applications such as fully adaptive noise cancellation, voice separation and Machine Learning (ML) are pushing the boundaries of embedded processing requirements, demanding more power-efficiency, hardware-level security and high reliability at the edge. With the launch of its PIC64 portfolio, Microchip Technology expanded its computing range to meet this rising demands.

New Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms Dramatically Expand Options for Mid-Tier Designs

March 26, 2024 by Joao Martins

New Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms Dramatically Expand Options for Mid-Tier Designs

Qualcomm Technologies International announced the new Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms, designed to allow OEMs deliver sound experiences never before possible at the S5 and S3 tiers. All Gen 3 devices support Bluetooth LE Audio and Auracast. The mid-tier S3 Gen 3 Sound Platform now allows customizations via 3rd party solutions from the Qualcomm Voice & Music Extension Program. And now there is a new quality option with aptX Lossless at 24-bit/48kHz.

XMOS and DSP Concepts Partner to Accelerate Audio and Voice DSP Applications

March 25, 2024 by Joao Martins

XMOS and DSP Concepts Partner to Accelerate Audio and Voice DSP Applications

XMOS has announced a partnership with DSP Concepts, the company behind Audio Weaver. The UK AI and semiconductor experts have partnered with the Californian embedded audio software specialists to combine XMOS' highly-deterministic, low latency xcore.ai platform with DSP Concepts' Audio Weaver software. The combined solution enables developers to graphically design and debug audio and voice solutions utilizing multicores easily from one single canvas.

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