All items tagged with product development and connected devices (75)

Imagimob Edge Makes TensorFlow AI Models Edge Device-Ready at the Click of a Button

October 19, 2020 by audioXpress Staff

Imagimob Edge Makes TensorFlow AI Models Edge Device-Ready at the Click of a Button

Imagimob, a company based in Stockholm, Sweden, developing artificial intelligence products for edge devices, announced a new SaaS solution that accelerates time to market for edge devices by converting h5 formatted AI models into ultra-efficient C-code in a matter of seconds — a process that once took weeks to complete. The new Imagimob Edge solution requires no programming skills and targets processing and interpreting sensor data in real time using trained models, a critical application in wearables and all sorts of connected devices.

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

September 14, 2020 by audioXpress Staff

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

Ambiq unveiled its latest Apollo4 SoC family, enabling next generation endpoint devices with record-setting energy efficiency - running as low as 3µA/MHz - and new levels of performance. The new Apollo4 systems enable manufacturers to create leading-edge endpoint devices leveraging the unique SPOT platform with Ambiq’s easy-to-use, rich peripheral set. The Apollo4 is available now with CSP and BGA package offerings, as well as an Apollo4 Blue SoC with Bluetooth LE.

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

August 6, 2020 by audioXpress Staff

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

TDK Corporation introduced the InvenSense ICS-40638 MEMS analog microphone, a new high-performance solution enabling clear audio capture in loud and noisy conditions, with an extended frequency response from 35 Hz to 20kHz. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port surface‐mount package.

New Renesas RYZ012 Module Provides Multi-Standard Wireless Communication Supporting Bluetooth Low Energy 5 and IEEE802.15.4 Based Standards

August 6, 2020 by Cristina Costa

New Renesas RYZ012 Module Provides Multi-Standard Wireless Communication Supporting Bluetooth Low Energy 5 and IEEE802.15.4 Based Standards

Renesas Electronics announced sample shipment availability of the new RYZ012 Bluetooth module targeting ultra-low power applications in connected devices. The RYZ012 is Renesas' first Bluetooth Low Energy 5 module. It integrates a 2.4 GHz RF transceiver supporting the IEEE802.15.4 multi-standard wireless protocol, Bluetooth Low Energy (LE), Bluetooth LE Mesh, and ZigBee. The RYZ012 features a power draw of only 0.4µA during deep sleep (without SRAM retention) allowing developers to extend battery life.

NXP Expands Secure Edge-Connected Platforms Based on its i.MX RT Crossover MCUs and Wi-Fi/Bluetooth Solutions

July 29, 2020 by audioXpress Staff

NXP Expands Secure Edge-Connected Platforms Based on its i.MX RT Crossover MCUs and Wi-Fi/Bluetooth Solutions

NXP Semiconductors announced that its Wi-Fi and Wi-Fi/Bluetooth combo solutions are now pre-integrated across its i.MX RT MCU platform, allowing developers to create the optimal pairing of processing with connectivity. NXP combined its MCU and Wi-Fi/Bluetooth platform solutions within its MCUXpresso Software Development Kit (SDK) to simplify and accelerate the development of connected designs. The company’s connectivity modules and MCU development kits are available now.

Next-Generation AVR DA Microcontroller Family From Microchip Enables Real-Time Control, Connectivity and HMI Applications

May 7, 2020 by audioXpress Staff

Next-Generation AVR DA Microcontroller Family From Microchip Enables Real-Time Control, Connectivity and HMI Applications

As the Internet of Things (IoT) delivers greater connectivity for industrial and home applications and as connected vehicles enhance cabin and operational features, higher-performance microcontrollers are required for better real-time control as well as to enable enhanced human machine interface applications. Microchip Technology announced its next generation AVR DA family of microcontrollers (MCUs) – its first Functional Safety Ready AVR MCU family with Peripheral Touch Controller (PTC).

Electrocomponents Introduces OKdo E1 Single Board Computer for Low-Cost Development of Connected Devices

May 5, 2020 by audioXpress Staff

Electrocomponents Introduces OKdo E1 Single Board Computer for Low-Cost Development of Connected Devices

OKdo, the new brand that is now part of the Electrocomponents Group (RS, Allied, DesignSpark), introduced its first own-branded single board computer (SBC), the E1. The E1 board features an NXP LPC55S69 microcontroller, which offers a high-performance, secure low-cost entry to the development of connected devices, and represents the start of the next phase in the company's evolution towards providing an accessible range of software, hardware, services and solutions.

Libre Wireless Technologies Single Chip MAVID Solution is Now Amazon AWS IoT Core Certified

April 28, 2020 by audioXpress Staff

Libre Wireless Technologies Single Chip MAVID Solution is Now Amazon AWS IoT Core Certified

Libre Wireless Technologies, the embedded wireless audio and voice/AI development platform company, announced that its MAVID low power mic-to-cloud edge computing solution expanded its unique RTOS platform to include new SDK releases. The company's flexible SDK for connected devices now features Amazon AWS IoT Core certification and leverages the responsive Free RTOS OS, combined in a scalable feature rich platform. The new development environment offers unique connectivity and libraries for manufacturers and ODMs developing on Libre Wireless's MAVID platform.

Qualcomm Announces New Ultra-Efficient NB2 IoT Chipset for Connected Applications

April 16, 2020 by audioXpress Staff

Qualcomm Announces New Ultra-Efficient NB2 IoT Chipset for Connected Applications

According to data from the GSMA, the world will see 3.2 billion cellular Internet-of-Things (IoT) connections in 2024. That is, billions of connected devices of all types in homes, companies, and cities. Qualcomm Technologies is already a leading supplier of wireless connectivity chipsets and they now announced a breakthrough new product to drive the growth of cellular IoT: the Qualcomm 212 LTE IoT Modem, introduced as the world’s most power-efficient single-mode NB2 (NB-IoT) chipset.

Goodix Licenses and Deploys CEVA Bluetooth Low Energy IP in SoCs Targeting Connected Devices

February 24, 2020 by Joao Martins

Goodix Licenses and Deploys CEVA Bluetooth Low Energy IP in SoCs Targeting Connected Devices

CEVA announced that Goodix Technology has licensed and deployed CEVA’s RivieraWaves Bluetooth low energy IP in its GR551x series of Bluetooth low energy System-on-Chip (SoCs). The GR551x series is designed to help users develop low-power Bluetooth-based products including smart mobile devices, wearables, and connected applications. Goodix just acquired NXP’s Voice and Audio Solutions (VAS) business.

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