VIA Labs Announces VL605 USB-C to HDMI 2.1 Protocol Converter with USB PD EPR Support

During Computex 2024, VIA Labs, one of the leading suppliers of USB4, SuperSpeed USB, USB Power Delivery Controllers, and now Display Controllers, announced the start of mass production and immediate availability for the VIA Labs VL605 USB-C to HDMI 2.1 Protocol Converter. The VL605 Protocol Converter achieved USB-IF certification for USB Power Delivery 3.1 with support for Extended Power Range (EPR) and HDMI 2.1 FRL certification and is now listed on the USB-IF Integrator's List under TID: 10462.

Nordic Semiconductor says it is shipping more than 1 million Bluetooth LE System-On-Chips (SoCs) every day, claiming market leadership in the emerging category. Expanding on the range of complete solutions for building LE Audio products, Nordic's nRF5340 dual-core SoC was designed to meet all requirements of LE Audio development. Using this SoC, Shenzhen Feasycom launched its FSC-BT631D advanced wireless audio module for dual-mode Bluetooth Classic audio and LE Audio product designs.

During the electronica 2022 show in Munich, Germany, Renesas Electronics unveiled plans to deliver a comprehensive set of advanced Wi-Fi offerings to complement its broad portfolio of industrial and connected products. In 2021, Renesas completed its acquisition of Celeno, a company from Israel specializing in wireless communication solutions, including advanced Wi-Fi chipsets for high-performance home networks, and is leveraging that technology to address a wide range WLAN access point applications for Wi-Fi 6/6E and Wi-Fi 7.

During its Snapdragon Summit 2022, Qualcomm unveiled the latest generation of Snapdragon processors and chips that will power mobile devices, wearables and countless consumer electronics and audio devices to be introduced in 2023. The Snapdragon S5 Gen 2, and the Snapdragon S3 Gen 2 Bluetooth audio chipsets are the evolution from the devices announced in 2022, designed to support Bluetooth LE Audio.