All items tagged with product development and CES 2023 (10)

Knowles Releases High-Performance Digital Voice Vibration Sensor for High-Fidelity Voice Pick-Up in TWS

April 4, 2023 by audioXpress Staff

Knowles Releases High-Performance Digital Voice Vibration Sensor for High-Fidelity Voice Pick-Up in TWS

Knowles released a low power, high bandwidth, specialized vibration sensor that can be used to filter background noise and create reliable, high-quality voice calling in noisy environments. The Knowles V2S200D Digital Voice Vibration Sensor, the first-of-its-kind for the brand works in conjunction with microphones to improve voice signal pick-up in True Wireless Stereo (TWS) earbuds.

PSB Speakers, Sonical and MQA Announce Partnership to Create Next-Generation Headphones

February 28, 2023 by Joao Martins

PSB Speakers, Sonical and MQA Announce Partnership to Create Next-Generation Headphones

PSB Speakers, together with hearables start-up Sonical and audio codecs specialists MQA, announced a partnership that intends to define a new category of high-resolution audio headphones. The collaboration is aimed at creating true hifi headphones and smart earbuds, combining MQA's SCL6 high resolution wireless audio transmission and Sonical’s CosmOS platform. Planned for release under the PSB Speakers brand by Q1 2024, the resulting products will be the first headphones to feature Sonical’s ear computing platform, enabling a variety of apps and software upgrades.

Infineon Announces Partner Ecosystem for Latest MERUS Multilevel Class-D Audio Amplifier Technology

January 18, 2023 by audioXpress Staff

Infineon Announces Partner Ecosystem for Latest MERUS Multilevel Class-D Audio Amplifier Technology

Infineon Technologies recently introduced its latest generation of MERUS multilevel Class-D audio amplifiers, and now the company announced new ecosystem partners that are ready to support interested developers and manufacturers with their design-in efforts. Partnering with the experts, the company aims to boost the adoption of these new amplifiers with a unique Class D modulation of up to 5 different output voltage levels.

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

January 13, 2023 by Joao Martins

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

At CES 2023, TDK InvenSense introduced the T5838 and T5837 PDM MEMS microphones that offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode. The company also announced the new SmartSound One development platform that provides a plug-and-play evaluation interface for its MEMS microphones, and the new VibeSense360 hardware and software solution suite for advanced true wireless stereo features.

Knowles Debuts Trio of SiSonic MEMS Microphones for High-Performance TWS and Hearable Designs

January 13, 2023 by Joao Martins

Knowles Debuts Trio of SiSonic MEMS Microphones for High-Performance TWS and Hearable Designs

Knowles introduced its latest series of SiSonic MEMS microphones at CES 2023. The new Titan (Digital), Falcon (Differential Analog), and Robin (Single Ended Analog) are a new trio of microphones providing advanced performance capabilities for space constrained ear and wearable applications like True Wireless Stereo (TWS) earbuds, smart watches, Augmented Reality (AR) glasses and Virtual Reality (VR) headsets.

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

January 9, 2023 by Joao Martins

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

Part of xMEMS Labs announcements at CES 2023, the innovative MEMS speaker company introduced Skyline, the world’s first discrete solid-state MEMS DynamicVent, a specific design with a valve that opens or closes by sensor fusion input from the earbud DSP and enables the benefits of both an open-fit (spatially aware) and closed-fit (occluded) earbud design. This enables smart TWS earbuds and hearing aids that create best-of-both-worlds user experiences in the same product.

GaN Systems and Axign Unveil 1000W Class-D Heatsinkless Audio Amplifier Design

January 6, 2023 by Joao Martins

GaN Systems and Axign Unveil 1000W Class-D Heatsinkless Audio Amplifier Design

GaN power semiconductors pioneer GaN Systems has once again teamed up with Dutch company Axign to unveil an even more powerful, 1000W Class-D GaN audio amplifier board at CES 2023. The new reference design merges best-in-class technologies from GaN Systems and Axign to enable unique audio systems that are smaller, more efficient, and offer better audio quality. The design is ideal for automotive, professional, and prosumer audio applications.

Nordic Semiconductor Selects Packetcraft Controller Software Delivering Advanced Bluetooth LE Audio Capability

January 3, 2023 by Joao Martins

Nordic Semiconductor Selects Packetcraft Controller Software Delivering Advanced Bluetooth LE Audio Capability

Packetcraft, a leading provider of Bluetooth embedded stacks and software solutions, announced their Bluetooth Qualified LE Controller is shipping with Nordic Semiconductor’s flagship nRF5340 dual-core Bluetooth 5.3 SoC enabling LE Audio in commercial products. At CES 2023, Packetcraft is already showcasing Bluetooth LE Audio and Auracast broadcast audio applications using Nordic’s nRF5340 SoC, including from Sonical, EMSi and Fanstel.

Femtosense Brings Affordable First Silicon for Audio Applications to CES 2023

December 21, 2022 by audioXpress Staff

Femtosense Brings Affordable First Silicon for Audio Applications to CES 2023

Femtosense announced the arrival and successful testing of its first silicon, substantiating the startup’s assertions that it will deliver significantly more efficient, lower cost and real-time AI processing for valuable and affordable consumer electronics. At CES 2023, the Edge AI company will demonstrate compelling audio applications with highly efficient, real-time artificial intelligence (AI) processing with low power, low cost requirements.

StreamUnlimited Showcases Matter Functionality at CES 2023

December 20, 2022 by audioXpress Staff

StreamUnlimited Showcases Matter Functionality at CES 2023

StreamUnlimited will attend CES 2023, promoting itself as the Matter System Integrator. With the strong momentum in the industry about the evolution of smart home solutions benefiting from Matter functionality, at CES 2023 the company will demonstrate the latest systems integrations as part of its StreamThings software stack. Matter, the highly anticipated standard for interoperable connectivity within the IoT space, has been a popular request from StreamUnlimited partners.