All items tagged with product development and CES 2017 (7)

Qualcomm Releases Next-Generation DDFA Audio Amplifier Technology

June 21, 2017 by audioXpress Staff

Qualcomm Releases Next-Generation DDFA Audio Amplifier Technology

Qualcomm Technologies International made exciting audio announcements in platforms and technologies for the development of next-generation audio products during its voice and music developer conference, held recently in Shenzhen, China. At the event, the company announced its new Smart Audio Platform for smart and networked speakers. Additionally, Qualcomm introduced its next generation Qualcomm DDFA audio amplifier technology for high-resolution audio devices including wireless speakers, soundbars, networked audio and headphone amplifiers.

Bluetooth 5 Audio Update - An Interview with Mark Powell, Executive Director, Bluetooth SIG

March 23, 2017 by Joao Martins

Bluetooth 5 Audio Update - An Interview with Mark Powell, Executive Director, Bluetooth SIG

Ahead of the Bluetooth World 2017 meeting (March 28-29 2017), which will bring together more than 1,000 developers, executives, and start-ups on a busy exhibition floor to promote Bluetooth development and applications, we thought it would be appropriate to share part of the interview we had with Mark Powell, Executive Director, Bluetooth SIG, at CES 2017, where we discussed the Bluetooth 5 roadmap.

Vesper and DSP Group Demo Near-Zero-Power Voice-Activation for Battery-Powered Devices at CES 2017

January 16, 2017 by audioXpress Staff

Vesper and DSP Group Demo Near-Zero-Power Voice-Activation for Battery-Powered Devices at CES 2017

During CES 2017, Vesper, together with DSP Group and Sensory, have demonstrated a turnkey development platform that boasts the lowest overall power consumption for far-field always-listening voice interfaces. At CES 2017, DSP Group also unveiled its new DBMD5 audio SoC built to drive clearer human-machine voice interactions.

NXP Introduces i.MX 8M Processor to Transform IoT Audio, Voice and Video Interactions

January 13, 2017 by audioXpress Staff

NXP Introduces i.MX 8M Processor to Transform IoT Audio, Voice and Video Interactions

At CES 2017, NXP Semiconductors (now part of Qualcomm) introduced its new i.MX 8M family of applications processors specifically designed to meet increasing audio and video system requirements for smart home and smart mobility applications such as over-the-top (OTT) set-top boxes, digital media adapters, surround sound, sound bars, A/V receivers, voice control, voice assistance, digital signage and general purpose human machine interface (HMI) solutions.

Knowles Launches New RAF Series Balanced Armature Drivers, Delivering Premium Sound in a New Design

January 4, 2017 by audioXpress Staff

Knowles Launches New RAF Series Balanced Armature Drivers, Delivering Premium Sound in a New Design

Knowles Corporation launched the new RAF Series balanced armature drivers to improve how hearable and earphone designers create the next generation of premium headsets. Developed for wireless products, the receiver’s small dimensions and high efficiency make it ideal for a number of applications. The new RAF Series, including IPx7 models, enables greater flexibility to improve critical features such as audio quality, connectivity, battery life, and water resistance without sacrificing size or comfort.

Conexant Showcases Next-Gen Voice as an Interface and USB-C Headset Solutions at CES 2017

January 4, 2017 by audioXpress Staff

Conexant Showcases Next-Gen Voice as an Interface and USB-C Headset Solutions at CES 2017

In line with market trends, at CES 2017 Conexant is showing new hardware and software solutions designed to enable new voice-enabled AI assistant devices and next-gen USB-C type headphones. Conexant is showcasing its latest embedded hardware and software solutions designed to make it easy for CE manufacturers to develop new high-performance voice-enabled products and USB-C digital headphones.

Nordic Semiconductor to Demonstrate Bluetooth 5 Enhancements at CES 2017

December 27, 2016 by Cristina Costa

Nordic Semiconductor to Demonstrate Bluetooth 5 Enhancements at CES 2017

Nordic Semiconductor in collaboration with its design partners are unveiling latest Bluetooth low energy and IEEE 802.15.4-enabled innovations at International CES 2017 in Las Vegas. The Norwegian company will demonstrate the capabilities of its Bluetooth 5-compatible nRF52 Series SoCs. Product demonstrations include contactless payment, wearables wireless charging, thread networking, voice-activated remote control, educational platforms, home automation and Bluetooth 5 enhancements.