All items tagged with product development and Cadence Design Systems (8)

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

October 29, 2021 by audioXpress Staff

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

Cadence Design Systems announced the new Cadence Tensilica HiFi 1 DSP, delivering increased voice- and music-processing performance with optimal neural network capability in a compact footprint with ultra-low energy, improving the user experience and extending battery life. The Tensilica HiFi 1 DSP is now the smallest and lowest power member of the HiFi DSP family, developed for battery-constrained applications, such as mobile, hearables, wearables, automotive, and connected devices.

Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs for Automotive, Mobile and Consumer Markets

April 26, 2021 by audioXpress Staff

Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs for Automotive, Mobile and Consumer Markets

Cadence Design Systems expanded its popular Tensilica Vision DSP product family with the debut of two new DSP IP cores for demanding and always-on AI applications. The Tensilica Vision P1 DSP is optimized for always-on and smart sensor applications in the consumer market, providing an energy-efficient solution. Packing an industry-leading 3.8 tera operations per second (TOPS), the flagship Cadence Tensilica Vision Q8 DSP delivers 2X performance and memory bandwidth compared to the Tensilica Vision Q7 DSP.

Cadence Announces Industry’s First Verification IP for PHY Covering Multiple Protocols

February 28, 2020 by audioXpress Staff

Cadence Announces Industry’s First Verification IP for PHY Covering Multiple Protocols

Cadence Design Systems announced the availability of the industry’s first Verification IP (VIP) that enables comprehensive and fast verification of the physical layer (PHY) for complex protocols such as PCIe 5.0, USB3/4, DDR5, LPDDR5, HBM and MIPI CSI-2 and DSI 2.0. This allows companies to thoroughly test and optimize their PHY designs, accelerating development.

Cadence Confirms Bluetooth LE Audio LC3 Codec Support for Tensilica HiFi DSPs

January 10, 2020 by audioXpress Staff

Cadence Confirms Bluetooth LE Audio LC3 Codec Support for Tensilica HiFi DSPs

Cadence Design Systems announced that an implementation of the Low Complexity Communications Codec (LC3) that is part of the next generation Bluetooth LE Audio specification, is available now for Cadence Tensilica HiFi DSPs and has even been delivered to a lead customer. LC3 provides higher audio quality at lower bandwidth and affords developers greater flexibility in making tradeoffs between audio quality, power consumption and other features for a more optimal user experience.

Cadence Announces Strategic Alliance Agreement with National Instruments to Improve Electronic System Development

December 3, 2019 by audioXpress Staff

Cadence Announces Strategic Alliance Agreement with National Instruments to Improve Electronic System Development

National Instruments and Cadence Design Systems, announced a system innovation strategic alliance to create an integrated design to test flow, leveraging reusable data and test IP from electronics design and verification to validation and production test for electronic system and semiconductor companies. Through the strategic alliance agreement, NI and Cadence expect the joint development of technology, methodology and intellectual property to streamline electronics development.

Cadence Announces Industry’s First Verification IP for USB4

March 15, 2019 by audioXpress Staff

Cadence Announces Industry’s First Verification IP for USB4

Cadence Design Systems announced the availability of the industry’s first Verification IP (VIP) in support of the recently announced USB4 standard. The Cadence VIP for USB4 enables engineers to develop standard-compliant system-on-chip (SoC) designs, completing functional verification of the design with less effort and greater assurance that the SoC will operate as expected, enabling early adoption of the next-generation USB standard protocol.

Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5 Dual-Mode Audio/Voice SoC

January 17, 2019 by audioXpress Staff

Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5 Dual-Mode Audio/Voice SoC

Cadence Design Systems announced that Optek has selected the Cadence Tensilica HiFi 3 DSP for its latest OTK528X Bluetooth 5 dual-mode audio/voice system on chip (SoC). Optek’s customers can now take advantage of the HiFi DSP ecosystem for optimized audio, voice and artificial intelligence (AI) speech-based recognition processing software utilized in applications including hearables, wireless speakers, soundbars, on/in ear headphones, multi-channel AVRs, musical instruments, and voice user interface (VUI) devices.

Cadence Introduces Tensilica HiFi 5 DSP Optimized for AI Speech and Audio Processing

November 1, 2018 by audioXpress Staff

Cadence Introduces Tensilica HiFi 5 DSP Optimized for AI Speech and Audio Processing

Cadence Design Systems announced the Cadence Tensilica HiFi 5 DSP for audio and voice, the company's first IP core optimized for high-performance far-field processing and artificial intelligence (AI)-based speech recognition processing. This fifth-generation HiFi DSP offers 2X audio processing and 4X neural network (NN) processing improvements versus the HiFi 4 DSP, making it ideal for voice-controlled user interfaces in digital home assistants and automotive infotainment.