All items tagged with product development and Bluetooth 5.3 (20)

STMicroelectronics Introduces First STM32 Wireless Module Leveraging Collaboration with Qualcomm

December 10, 2024 by Cristina Costa

STMicroelectronics Introduces First STM32 Wireless Module Leveraging Collaboration with Qualcomm

STMicroelectronics introduced the first result of its strategic collaboration with Qualcomm Technologies to simplify development of next-generation STM32-based wireless solutions. The new ST67W611M1 modules combine Wi-Fi6, Bluetooth 5.3 and Thread connectivity to accelerate development of advanced consumer wireless solutions. Applications in home audio and smart home, powered by edge AI are a natural use case.

Synaptics Launches Veros High-Performance Wireless Combo SoCs

October 17, 2024 by audioXpress Staff

Synaptics Launches Veros High-Performance Wireless Combo SoCs

Synaptics launched the Veros Seamless Intelligent Connectivity brand with two high-performance systems on chip (SoCs) for Wi-Fi 6E, Bluetooth, and 802.15.4. The two new wireless combo chips from Synaptics, the SYN4383 triple combo (Wi-Fi/Bluetooth/802.15.4) and tri-band (2.4GHz, 5GHz, 6GHz ), and the SYN43756E, also a multi-protocol, tri-band solution that offers a cost-effective version aimed at products not requiring 802.15.4 support, enable product developers to integrate essential wireless protocols including Bluetooth LE Audio.

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

VeriSilicon Now Offers Fully Compliant Bluetooth LE Audio IP Solutions

April 1, 2024 by Joao Martins

VeriSilicon Now Offers Fully Compliant Bluetooth LE Audio IP Solutions

VeriSilicon Microelectronics announced that its complete Bluetooth Low Energy (BLE) IP solution has achieved full LE Audio specification compliance, including certifications for the LE Audio protocol stack and Low Complexity Communications Codec (LC3). The Shanghai, China-based company is now able to offers manufacturers, ODMs and OEMs its own range of wireless audio and DSP solutions enabling higher quality audio streaming across various applications with lower power and cost.

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

January 12, 2024 by audioXpress Staff

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

Frontier Smart Technologies unveiled a collaboration with Realtek for its AURIA Bluetooth LE Audio and Wi-Fi module, which features Auracast support. The audio module has been designed and engineered for simple integration into various audio products, and comes with a customizable SDK, rich I/O, comprehensive documentation and technical support. The latest Realtek Ameba chips ensure support for the latest technologies.

Synaptics Introduces Wi-Fi 6E and Bluetooth 5.3 Wireless SoC Ideal for Auracast

November 9, 2023 by Joao Martins

Synaptics Introduces Wi-Fi 6E and Bluetooth 5.3 Wireless SoC Ideal for Auracast

Synaptics announced the expansion of its wireless connectivity family with the introduction of the SYN43711. This Wi-Fi 6E and Bluetooth 5.3 tri-band combo system on chip (SoC) is ready to support Bluetooth 5.3 with LE Audio for multiple concurrent Bluetooth connections and audio streams, including Auracast. Delivering best-in-class rate-over-range and interoperability in a cost-effective form factor, the SYN43711 targets high-performance applications with audio and video streaming.

Frontier Introduces AURIA Bluetooth LE Audio, Auracast, and Wi-Fi Turnkey Platform

October 10, 2023 by Joao Martins

Frontier Introduces AURIA Bluetooth LE Audio, Auracast, and Wi-Fi Turnkey Platform

Following a presentation at IFA 2023 in Berlin, Frontier Smart Technologies is now launching its first Bluetooth Low Energy (LE) Audio and Wi-Fi module, ready for use in consumer products. The new AURIA board also features Auracast support, allowing Bluetooth audio synchronization across multiple speakers. The module has been designed and engineered for simple and straightforward integration into various audio products, and comes with a customizable SDK, rich I/O, comprehensive documentation and technical support.

STMicroelectronics Simplifies Wireless Product Development With Certified STM32WB1MMC Bluetooth LE Module

March 16, 2023 by audioXpress Staff

STMicroelectronics Simplifies Wireless Product Development With Certified STM32WB1MMC Bluetooth LE Module

The new STM32 Bluetooth wireless module from STMicroelectronics lets designers access the advantages of ST’s dual core STM32WB microcontrollers (MCUs), especially in projects intended for low-to-medium production volumes. The module simplifies development and accelerates time to market, combining Bluetooth Low Energy 5.3 certification and worldwide radio-equipment approvals with the STM32Cube ecosystem support.

Nordic Semiconductor Selects Packetcraft Controller Software Delivering Advanced Bluetooth LE Audio Capability

January 3, 2023 by Joao Martins

Nordic Semiconductor Selects Packetcraft Controller Software Delivering Advanced Bluetooth LE Audio Capability

Packetcraft, a leading provider of Bluetooth embedded stacks and software solutions, announced their Bluetooth Qualified LE Controller is shipping with Nordic Semiconductor’s flagship nRF5340 dual-core Bluetooth 5.3 SoC enabling LE Audio in commercial products. At CES 2023, Packetcraft is already showcasing Bluetooth LE Audio and Auracast broadcast audio applications using Nordic’s nRF5340 SoC, including from Sonical, EMSi and Fanstel.

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

November 17, 2022 by Joao Martins

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

During its Snapdragon Summit 2022, Qualcomm unveiled the latest generation of Snapdragon processors and chips that will power mobile devices, wearables and countless consumer electronics and audio devices to be introduced in 2023. The Snapdragon S5 Gen 2, and the Snapdragon S3 Gen 2 Bluetooth audio chipsets are the evolution from the devices announced in 2022, designed to support Bluetooth LE Audio.

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