All items tagged with product development and Bluetooth 5.2 (22)

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

March 13, 2024 by Joao Martins

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

Under the theme of "Realtek AI Changing the Future," the Taiwan semiconductor company will exhibit at the AWE China Expo (March 14-17, 2024), at the Shanghai New International Expo Centre (SNIEC). Showcasing the possibilities of AI in connected applications, Realtek will present a hybrid AIoT Audio SoC that supports both dual‑band Wi‑Fi 6 (2.4GHz/5GHz) and dual-mode Bluetooth 5.2 to enable low-latency, high resolution audio playback applications.

IOT747 and AntennaWare Launch Reference Design for Wearable Applications

February 16, 2023 by Joao Martins

IOT747 and AntennaWare Launch Reference Design for Wearable Applications

IOT747, a Cambridge, UK-based supplier of wireless modules and solutions announced a partnership with AntennaWare, the Northern Ireland-based developer of Bluetooth and Ultra-Wideband (UWB) antenna solutions for wireless wearables. The partnership integrates AntennaWare BodyWave Antenna with the IDC737 Bluetooth module in an example reference design for long-range and wearable applications.

Synaptics Launches KatanaConnect Miniature Wireless AI Vision and Audio Module

November 25, 2022 by audioXpress Staff

Synaptics Launches KatanaConnect Miniature Wireless AI Vision and Audio Module

Synaptics launched an interesting new AI System on Module (SoM) at electronica 2022. KatanaConnect combines the Katana low-power Edge AI SoC with Wi-Fi / Bluetooth wireless connectivity in an ultra-small-form-factor package to deliver AI-enabled computer vision and audio sensing capabilities. The SoM, developed with leading module vendor AMPAK, is a ready-to-use solution that enables rapid implementation of AI sensing features for connected designs targeting a range of applications, including smart home and security, and many others.

Renesas Lays Out Roadmap for Wi-Fi 6/6E and 7 Chipsets

November 18, 2022 by Joao Martins

Renesas Lays Out Roadmap for Wi-Fi 6/6E and 7 Chipsets

During the electronica 2022 show in Munich, Germany, Renesas Electronics unveiled plans to deliver a comprehensive set of advanced Wi-Fi offerings to complement its broad portfolio of industrial and connected products. In 2021, Renesas completed its acquisition of Celeno, a company from Israel specializing in wireless communication solutions, including advanced Wi-Fi chipsets for high-performance home networks, and is leveraging that technology to address a wide range WLAN access point applications for Wi-Fi 6/6E and Wi-Fi 7.

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

June 22, 2022 by Cristina Costa

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

February 3, 2022 by Joao Martins

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

Synaptics announced the SYN4381 Triple Combo system-on-chip (SoC), the first to combine Wi-Fi 6/6E (802.11ax with extended 6 GHz operation), Bluetooth 5.2 (BT 5.2) with BLE Audio and High Accuracy Distance Measurement (HADM), and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer. The solution simplifies product development while supporting 600 Mbps video and data, low-power Thread communication, and platform-agnostic device setup and interoperability.

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

January 13, 2022 by Joao Martins

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

NXP Semiconductors announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2 and 802.15.4 (Zigbee, Thread, Z-Wave, Matter) protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive and industrial use cases. The single SoC enables simultaneous transmit and receive for higher performance in smart solutions, and supports Matter, the new interoperable, secure connectivity standard for the smart home.

Renesas Announces Development of Next-Generation Wireless MCUs Supporting New Bluetooth 5.3 Low Energy Specification

October 22, 2021 by audioXpress Staff

Renesas Announces Development of Next-Generation Wireless MCUs Supporting New Bluetooth 5.3 Low Energy Specification

Renesas Electronics announced that it is developing new microcontrollers (MCUs) that will support the recently released Bluetooth 5.3 Low Energy (LE) Specification. The new devices will be part of the Renesas Advanced (RA) Family of 32-bit Arm Cortex-M microcontrollers, joining the RA4W1 Bluetooth 5.0 LE device introduced in 2020. Renesas expects to have first samples of the new MCUs in the first quarter of 2022.

Skullcandy's New Under $100 True Wireless Earbuds Offer Skull-iQ Smart Feature Technology

September 29, 2021 by audioXpress Staff

Skullcandy's New Under $100 True Wireless Earbuds Offer Skull-iQ Smart Feature Technology

True wireless earbuds that offer truly differentiated features, such as hands-free control via simple voice commands, personal audio profiles, and software updates, are now a reality under $100. Coming from Skullcandy, the popular headphone brand leading that price category, the new Grind Fuel and Push Active TWS designs offer those features thanks to Bragi OS, and over 18 months of development effort by the Skullcandy and Bragi teams.

STMicroelectronics Accelerates Wireless Product Development with STM32 Microcontroller Ecosystem

September 17, 2021 by audioXpress Staff

STMicroelectronics Accelerates Wireless Product Development with STM32 Microcontroller Ecosystem

STMicroelectronics is easing the design of competitively priced and power-efficient wireless equipment for smart applications in buildings and infrastructure by introducing new development tools and software for STM32WB wireless microcontrollers (MCUs). The company announced that his STM32Cube ecosystem was extended to support STM32WB wireless MCUs, with new STM32CubeWB firmware, upgrades to programmer and RF test tool, and an enhanced wireless power estimator for calculating battery runtime.

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