All items tagged with product development and Augmented Reality (7)

AKM Launches AK5705 Low Power 4-Channel 32-bit A/D Converter

July 25, 2023 by audioXpress Staff

AKM Launches AK5705 Low Power 4-Channel 32-bit A/D Converter

Asahi Kasei Microdevices (AKM) has developed the AK5705, a low power consumption 4-channel 32-bit A/D converter (ADC) with a built-in transimpedance amplifier in addition to a low-noise microphone amplifier. The new AKM the AK5705 ADC is connectable to current output sensors, supports a sampling frequency of 384kHz, and achieves a dynamic range of 109dB, while consuming 43% less power than existing AKM products. The built-in AC coupling capacitor significantly reduces the mounting area including external components.

STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

March 7, 2023 by audioXpress Staff

STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

STMicroelectronics has announced the LSM6DSV16BX, a unique highly integrated sensor that delivers important space savings inside hearable devices or general-purpose TWS earbuds, including for sports. The new device delivers longer listening experiences and superior hearing by combining a 6-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1KHz.

Cambridge Mechatronics Announces Ultra-slim, High Precision Rotary Actuator

December 7, 2021 by Joao Martins

Cambridge Mechatronics Announces Ultra-slim, High Precision Rotary Actuator

Cambridge Mechatronics, a leading British company and developer of Shape Memory Alloy (SMA) actuators has developed a new ultra-slim, high precision rotary actuator product. The actuator characteristics include lightweight design, two thousand step positions per revolution and it is completely non-magnetic so it can operate in areas of high magnetic flux that might otherwise exclude conventional motor technologies. With a low profile of around 1mm, it can be used in the most space-constrained applications.

STMicroelectronics Establishes World’s First “Lab-in-Fab” to Advance Adoption of Piezoelectric MEMS in Singapore

November 2, 2020 by audioXpress Staff

STMicroelectronics Establishes World’s First “Lab-in-Fab” to Advance Adoption of Piezoelectric MEMS in Singapore

STMicroelectronics, a leading manufacturer of Micro-Electromechanical Systems (MEMS) technology, announced a collaboration with A*STAR’s Institute of Microelectronics (IME), a research institute in Singapore, and ULVAC, a leading Japanese manufacturing-tool vendor, to jointly setup and operate an 8-inch (200mm) R&D line focused on Piezo MEMS technology within ST’s existing manufacturing facility in Singapore. The concept aims to advance the adoption of piezoelectric MEMS in new applications including augmented reality.

AKM Launches Low Power Solution for True Wireless Stereo (TWS) Development with ANC and Promotes Complete Solution Portfolio

September 18, 2020 by Joao Martins

AKM Launches Low Power Solution for True Wireless Stereo (TWS) Development with ANC and Promotes Complete Solution Portfolio

Demand for True Wireless Stereo (TWS) products reflect the growing demand for multi-function, health care, and connected wearable solutions, all requiring smaller and longer battery life devices. Asahi Kasei Microdevices (AKM) has recently introduced the AKM AK4336ECB ultra low power audio codec, a 4-channel ADC and one channel DAC that supports active noise cancelling designs, complementing its complete portfolio of audio systems and sensors for TWS development.

CEVA Announces SensPro High Performance Sensor Hub DSP Architecture for Smart Devices

April 7, 2020 by audioXpress Staff

CEVA Announces SensPro High Performance Sensor Hub DSP Architecture for Smart Devices

CEVA announced a new high performance sensor hub DSP architecture designed to handle the broad range of sensor processing and sensor fusion workloads for contextually-aware devices. The new SensPro device family serves as a hub for processing and fusing of data from multiple sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units. This highly-configurable and self-contained architecture brings together scalar and parallel processing for floating point and integer data types, as well as deep learning training and inferencing.

Cadence Launches New Tensilica DNA 100 Processor IP for On-Device Artificial Intelligence Applications

September 20, 2018 by audioXpress Staff

Cadence Launches New Tensilica DNA 100 Processor IP for On-Device Artificial Intelligence Applications

Cadence Design Systems announced the Cadence Tensilica DNA 100 Processor IP, the first deep neural-network accelerator (DNA) AI processor IP to deliver both high performance and power efficiency across a full range of compute from 0.5 TeraMAC (TMAC) to 100s of TMACs. As a result, the DNA 100 processor is well suited for on-device neural network inference applications spanning autonomous vehicles (AVs), ADAS, surveillance, robotics, drones, augmented reality (AR) /virtual reality (VR), smartphones, smart home and connected devices.