CEVA and VisiSonics Offer 3D Spatial Audio Development for True Wireless Earbuds and Headphones

CEVA and VisiSonics, a developer of patented 3D spatial audio technologies, announced that the companies have collaborated closely together to develop a comprehensive 3D spatial audio solution for embedded devices, including true wireless audio (TWS) earbuds, headphones and other hearables. The collaboration combines VisiSonics' RealSpace 3D audio software optimized for CEVA’s low power audio and sensor hub DSPs together with CEVA’s MotionEngine head tracking algorithms running on its BNO080 9-axis System in Package (SiP).

IFA 2020, in Berlin, Germany, was "the first major global fair for consumer and home electronics" to physically take place since the pandemic. This limited push to promote a trade show again, lead some major consumer electronics companies and brands to converge their announcements in the week from September 1-5, with showcases streamed to the world live from the Berlin exhibition grounds. Some announcements were relevant to the audio industry and included the Qualcomm press conference, which used the opportunity to launch its latest Adaptive ANC platform, an important step towards smart true wireless earbuds.