All items tagged with product development and artificial intelligence (51)

Silicon Labs Introduces BG22L and BG24L "Lite" Bluetooth LE SoCs

January 31, 2025 by audioXpress Staff

Silicon Labs Introduces BG22L and BG24L "Lite" Bluetooth LE SoCs

Silicon Labs introduced the BG22L and BG24L SoCs for Bluetooth LE connectivity, with "L" representing the new application-optimized Lite devices. These new ultra-low power Bluetooth devices are optimized for applications like asset tracking tags, remote control, and small appliances. The BG22L delivers robust security and processing for common Bluetooth devices, while BG24L supports advanced AI/ML acceleration and Channel Sounding.

Grinn Unveils AstraSOM-1680 Edge AI Module

December 4, 2024 by Joao Martins

Grinn Unveils AstraSOM-1680 Edge AI Module

Grinn, an electronics design and engineering development house, announced the launch of its latest System on Module, the Grinn AstraSOM-1680, powered by the advanced Synaptics Astra SL1680 embedded processor. The Grinn AstraSOM-1680 is a compact, high-performance module designed to bring new capabilities to edge devices, enabling smart camera applications and AI-intensive applications such as Natural Language Processing.

Create Your Own Privacy-Focused Voice Assistant. Open Webinar, December 10

November 29, 2024 by audioXpress Staff

Create Your Own Privacy-Focused Voice Assistant. Open Webinar, December 10

The Audio Product Development Alliance (APDA) is hosting a live webinar with Sensory, to discuss the latest evolution in voice interfaces and how manufacturers can implement product-specific voice assistants without privacy concerns. During the streaming event, Jeff Rogers (VP, Sales & Marketing, Sensory) will discuss how voice recognition, voice interfaces and voice assistants are now accessible to brands and manufacturers, creating a major opportunity for differentiation.

Siemens Unveils Next-Generation AI-Enhanced Electronic Systems Design Software

November 13, 2024 by audioXpress Staff

Siemens Unveils Next-Generation AI-Enhanced Electronic Systems Design Software

With a focus on a modern, AI-assisted, user experience, Siemens Digital Industries Software announced the next generation release of its Xpedition electronic systems design software that simplifies complex PCB design processes, and aims to reduce learning curves, and accelerate productivity. This release combines Xpedition, Hyperlynx and PADS Professional software through a unified user experience with cloud connectivity and collaboration. The update also adds enhanced integration with Siemens’ Teamcenter and NX Software.

Ceva and Edge Impulse Join Forces to Enable Faster Development of Edge AI Applications

September 24, 2024 by audioXpress Staff

Ceva and Edge Impulse Join Forces to Enable Faster Development of Edge AI Applications

Ceva and Edge Impulse announced a collaboration to rapidly develop, train and deploy advanced embedded machine learning (ML) applications on Ceva's neural processing units with cycle-accurate performance, even before physical hardware is available. This first-of-its-kind collaboration based around Ceva's NPU IP ensures that developers can accurately benchmark and refine the performance of their edge AI models using Edge Impulse's platform, significantly accelerating the time-to-market.

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

Voicemod Makes AI-Powered Sing-to-Sing Technology Available to Developers

July 5, 2024 by Joao Martins

Voicemod Makes AI-Powered Sing-to-Sing Technology Available to Developers

Voicemod's Sing-to-Sing AI technology enables users to modify their singing voice in real-time, including pitch, timbre adjustments and automatic voice tuning with features such as choir, duet, evolver and calitune. For the first time, Voicemod's Sing-to-Sing AI technology is available for third-party developers and hardware manufacturers via Voicemod's SDK, which also supports the company's Speech-to-Speech and Soundboard functionalities.

Knowles Enhances Performance for Meizu LIVE AI Noise Cancelling Hi-Fi Earbuds

May 23, 2024 by Joao Martins

Knowles Enhances Performance for Meizu LIVE AI Noise Cancelling Hi-Fi Earbuds

Knowles Corporation announced that Meizu, a consumer audio brand from China, has selected Knowles balanced armature (BA) drivers and SiSonic high-performance MEMS microphones to produce premium sound for its new LIVE AI Noise Cancelling Hi-Fi Earbuds. Now available in China and other countries in the APAC region, the Meizu LIVE AI earbuds combine the BAs with a coaxial driver, tuned to the Knowles Preferred Listening Curve. Meizu also offers a first-of-its-kind capability that uses artificial intelligence to identify user listening preferences.

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

March 13, 2024 by Joao Martins

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

Under the theme of "Realtek AI Changing the Future," the Taiwan semiconductor company will exhibit at the AWE China Expo (March 14-17, 2024), at the Shanghai New International Expo Centre (SNIEC). Showcasing the possibilities of AI in connected applications, Realtek will present a hybrid AIoT Audio SoC that supports both dual‑band Wi‑Fi 6 (2.4GHz/5GHz) and dual-mode Bluetooth 5.2 to enable low-latency, high resolution audio playback applications.

Orosound Labs Innovation Division Accelerates AI-Enabled Hearables

January 5, 2024 by Joao Martins

Orosound Labs Innovation Division Accelerates AI-Enabled Hearables

Orosound, a company with patented signal processing and noise-canceling technologies, has unveiled Orosound Labs, its advanced innovation division that has operated sub rosa for the last couple of years. As the company stands at the forefront of AI-enabled active noise cancellation and reduction technologies that are ready to be embedded in consumer brand products, Orosound Labs is committed to empowering partners with a faster and more reliable way to introduce hearables with unique AI features to the market.

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