STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

STMicroelectronics has announced the LSM6DSV16BX, a unique highly integrated sensor that delivers important space savings inside hearable devices or general-purpose TWS earbuds, including for sports. The new device delivers longer listening experiences and superior hearing by combining a 6-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1KHz.

At CES 2023, TDK InvenSense introduced the T5838 and T5837 PDM MEMS microphones that offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode. The company also announced the new SmartSound One development platform that provides a plug-and-play evaluation interface for its MEMS microphones, and the new VibeSense360 hardware and software solution suite for advanced true wireless stereo features.

AIStorm, a pioneer of AI-in-Sensor SoCs for edge devices, announced a development partnership with Knowles Corporation. The collaboration will focus on achieving the lowest-power, highest-performance audio solutions available to enable emerging features. AIStorm’s patented analog and mixed-signal IP, combined with Knowles’ audio signal processing technology and advanced micro-acoustic microphones and speakers, bring enhanced audio features and power savings to mobile, true wireless stereo (TWS) earbuds, and connected devices.