Waves Maxx Audio Sound Enhancement Technology Now Available On Knowles Advanced Audio Processors

Waves confirmed that its MaxxAudio Sound enhancement technology is now available on the newest Knowles AISonic Audio Edge Processor, the IA8201. The joint solution makes it easy for design engineers to integrate studio-quality sound into consumer electronics products. Knowles joins an expanding list of chip partners for Waves, supporting developers working to enhance sound on mobile devices, premium smartphones and smart peripherals featuring augmented reality (AR) and gaming.

Waves MaxxAudio and Nx 3D audio processing technologies are now compatible with the new Qualcomm Snapdragon 865, 765 and 765G mobile processors targeting the latest smartphones and powering augmented experiences, gaming, and more. These Waves technologies have been until now mainly available on Intel and ARM processor-based platforms. This new combination will allow manufacturers implementing Snapdragon processors in premium smartphones and smart peripherals to also support expanded audio experiences.

A new generation of effective and powerful speaker protection technology, using literally all the capabilities and power of pro sound rackmount loudspeaker management processors, is now being designed into mobile audio products that use very small loudspeakers. The implications are that mobile consumer electronics are going to play louder and sound better than ever. But to optimize speakers this way, we need to understand what causes loudspeakers to fail. This article was published originally in audioXpress, August 2013.

Cadence Design Systems, announced the Cadence Tensilica HiFi 3z DSP IP core for system-on-chip (SoC) designs targeted for the latest mobile and home entertainment applications, including smartphones, augmented reality (AR)/3D goggles, digital TVs and set-top boxes (STBs). The new HiFi 3z architecture offers more than 1.3X better voice and audio processing performance than its predecessor, the HiFi 3 DSP, which leads the industry in the number of audio DSP cores shipped.

Cadence Design Systems and Waves Audio announced the availability of the Waves Nx Virtual Reality Audio Technology on the Cadence Tensilica HiFi 3 DSP for Audio, Voice, and Speech. The Waves Nx solution, which delivers high-quality VR audio and true 5.1 or 7.1 surround with a minimal resource footprint, will be demonstrated at the Cadence booth at Mobile World Congress in Barcelona, February 27 to March 2, 2017, in Hall 6, Stand 6L36.