All items tagged with product development and TDK (16)

AONDevices Unveils Edge AI Sensor Module in Collaboration with P-Logic Consulting

December 16, 2024 by Joao Martins

AONDevices Unveils Edge AI Sensor Module in Collaboration with P-Logic Consulting

AONDevices announced the launch of its AONix Edge AI sensor module, a new platform that addresses key challenges for battery-operated connected devices running artificial intelligence on the edge. Developed in collaboration with P-Logic Consulting and featuring sensor integration from TDK InvenSense, this compact 32mm x 32mm module is an energy-efficient platform with the ability to deliver real-time AI performance in always-on applications, particularly for consumer electronics.

TDK Unveils New Material for Solid-State Batteries With 100-Times Higher Energy Density

June 17, 2024 by Joao Martins

TDK Unveils New Material for Solid-State Batteries With 100-Times Higher Energy Density

TDK Corporation announced the successful development of a new material for next-generation solid-state batteries with an energy density of 1,000 Wh/L, or approximately 100 times greater than the energy density of TDK's conventional solid-state battery. This development could accelerate the introduction of solid-state batteries in the market, starting with relatively low-power consumer electronics, enabling an effective and attractive replacement of lithium-ion batteries.

TDK Launches Noise Suppression Filters for Audio Lines of High Sound Quality Devices

November 24, 2023 by Cristina Costa

TDK Launches Noise Suppression Filters for Audio Lines of High Sound Quality Devices

TDK Corporation has announced its latest compact noise suppression filters MAF1005FR series, measuring 1mm (L) x 0.5mm (W) x 0.5mm (H). These multilayer chip components are designed to improve sound quality and reduce noise interference in the audio lines (sound lines) of smartphones, portable devices, and wearables. Mass production of the new EMC components series started in November 2023.

TDK Redefines True Wireless Stereo Applications with VibeSense360 Solution Suite

May 4, 2023 by Joao Martins

TDK Redefines True Wireless Stereo Applications with VibeSense360 Solution Suite

TDK Corporation announced the availability of its InvenSense VibeSense360 TWS solution suite, previewed at CES 2023. VibeSense360 is a comprehensive portfolio of TDK hardware and software solutions designed to help solve some of the most complicated problems OEMs face when designing true wireless stereo (TWS) products with state-of-the-art features. On the hardware VibeSense360 includes the TWS-M601 6-axis IMU, and the TWS-M602 device, combining IMU, accelerometer and machine learning on-chip.

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

January 13, 2023 by Joao Martins

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

At CES 2023, TDK InvenSense introduced the T5838 and T5837 PDM MEMS microphones that offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode. The company also announced the new SmartSound One development platform that provides a plug-and-play evaluation interface for its MEMS microphones, and the new VibeSense360 hardware and software solution suite for advanced true wireless stereo features.

Highly Anticipated Return for electronica 2022, November 15 to 18

November 8, 2022 by audioXpress Staff

Highly Anticipated Return for electronica 2022, November 15 to 18

electronica, the world’s leading trade fair and conference for electronics, will take place in 14 halls on the Munich exhibition grounds from November 15 to 18, 2022. This is a highly-anticipated return for a show that promises to reengage multiple critical sectors in development and manufacturing, after four years of absence. This year’s highlights in the electronica Conference will deal with Automotive, Embedded Platforms, Sensors, and Wireless Systems and Applications.

Cambridge Mechatronics Announces Ultra-slim, High Precision Rotary Actuator

December 7, 2021 by Joao Martins

Cambridge Mechatronics Announces Ultra-slim, High Precision Rotary Actuator

Cambridge Mechatronics, a leading British company and developer of Shape Memory Alloy (SMA) actuators has developed a new ultra-slim, high precision rotary actuator product. The actuator characteristics include lightweight design, two thousand step positions per revolution and it is completely non-magnetic so it can operate in areas of high magnetic flux that might otherwise exclude conventional motor technologies. With a low profile of around 1mm, it can be used in the most space-constrained applications.

TDK Launches Inductors for Small Power Systems in True Wireless Stereo Devices

March 29, 2021 by audioXpress Staff

TDK Launches Inductors for Small Power Systems in True Wireless Stereo Devices

TDK Corporation has developed the PLEA67 Series of inductors for use in true wireless stereo (TWS) devices. TDK’s original structure design and newly developed materials in the new thin-film power inductors achieve a rated current of 500mA in a small-sized component with an inductance of 2.2μH. The unique magnetic shield structure reduces magnetic flux leakage, while the low-loss magnetic material provides a highly efficient power supply circuit, ideal for small power supply and low power consumption Bluetooth LE modules.

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

September 22, 2020 by audioXpress Staff

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

In the wake of the acquisition of the Hillcrest Laboratories (Hillcrest Labs) business from InterDigital in mid-2019, CEVA now introduced the Hillcrest Labs MotionEngine Hear, a sensor and processor agnostic embedded software solution for hearable devices. The new solution allows SoC vendors, OEMs and ODMs to take advantage of a configurable sensor fusion platform to add intuitive user interface, gesture control, activity tracking and spatial audio capabilities to hearable devices.

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

August 6, 2020 by audioXpress Staff

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

TDK Corporation introduced the InvenSense ICS-40638 MEMS analog microphone, a new high-performance solution enabling clear audio capture in loud and noisy conditions, with an extended frequency response from 35 Hz to 20kHz. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port surface‐mount package.

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