All items tagged with product development and System-on-Chip (15)

Synaptics Introduces World's First AI SoC Optimized for Unified Communication and Collaboration Products

October 31, 2023 by audioXpress Staff

Synaptics Introduces World's First AI SoC Optimized for Unified Communication and Collaboration Products

Synaptics announced the availability of the DVF120, a power-efficient and cost-optimized system on chip (SoC) that is optimized for advanced Unified Communication and Collaboration (UC&C) products, and leverages the company's experience to integrate all major features required for such applications. The SoC extends its range of compute engines with a field-proven Linux and Android SDK, enterprise-grade security, and native support of popular collaboration platforms.

Microchip Announces New Arm-Based PIC with Built-in Bluetooth Low Energy Connectivity

October 19, 2022 by Cristina Costa

Microchip Announces New Arm-Based PIC with Built-in Bluetooth Low Energy Connectivity

Microchip Technology introduced its first Arm Cortex-M4F-based PIC microcontroller (MCU) family that solves basic wireless connectivity design challenges by integrating Bluetooth Low Energy functionality directly into one of a system’s most basic components, supported by one of the industry’s most comprehensive developer ecosystems. Microchip's new PIC32CX-BZ2 MCU family is available in SoCs QFN packages and complete PCB modules and antenna.

Nordic Semiconductor nRF5340 Audio DK Accelerates Bluetooth LE Audio Developments

May 20, 2022 by Cristina Costa

Nordic Semiconductor nRF5340 Audio DK Accelerates Bluetooth LE Audio Developments

The next generation of wireless audio projects is now getting on the bench, as developers get access to the first Bluetooth LE Audio evaluation platforms. Nordic Semiconductor has long been a reference in Bluetooth development platforms and has now released its nRF5340 Bluetooth LE Audio DK board, which includes everything required for developers to take advantage of the latest Bluetooth standard, including LC3 codec, low power consumption, and wireless stereo enhancements.

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

February 3, 2022 by Joao Martins

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

Synaptics announced the SYN4381 Triple Combo system-on-chip (SoC), the first to combine Wi-Fi 6/6E (802.11ax with extended 6 GHz operation), Bluetooth 5.2 (BT 5.2) with BLE Audio and High Accuracy Distance Measurement (HADM), and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer. The solution simplifies product development while supporting 600 Mbps video and data, low-power Thread communication, and platform-agnostic device setup and interoperability.

Nordic Launches Apple Find My Network Compatible Software Development Kit

May 27, 2021 by audioXpress Staff

Nordic Launches Apple Find My Network Compatible Software Development Kit

Nordic Semiconductor announced the availability of its Apple Find My network compatible Software Development Kit (SDK). The SDK enables manufacturers and brands to easily build Find My network capable Bluetooth Low Energy (Bluetooth LE) devices that maximize battery performance leveraging Nordic’s nRF52 or nRF53 Series System-on-Chip's (SoC) ultra-low power consumption.

DSP Group Ships 100 Million SmartVoice SoCs

October 13, 2020 by audioXpress Staff

DSP Group Ships 100 Million SmartVoice SoCs

Demonstrating the importance of voice as a user interface in applications ranging from smartphones, tablets and laptops/PCs, to the smart home, wearables, and all types of connected devices, DSP Group announced it has shipped its 100 millionth SmartVoice system-on-chip (SoC), marking a major milestone in the journey of voice user interfaces (VUIs) from a novelty to a necessity. This milestone is testimony to the importance DSP Group’s customers, including Google, Amazon, Facebook, GoPro, Logitech, Samsung, Lenovo, and Leviton all place on end-user VUI experience.

Microchip Launches Industry’s First SoC FPGA Development Kit Based on the RISC-V Instruction Set Architecture

September 18, 2020 by audioXpress Staff

Microchip Launches Industry’s First SoC FPGA Development Kit Based on the RISC-V Instruction Set Architecture

The rising adoption of the free and open RISC-V Instruction Set Architecture (ISA) is driving the need for an affordable, standardized development platform that embeds RISC-V technology and leverages the diverse RISC-V ecosystem. To meet this need, Microchip Technology is offering the industry’s first RISC-V based System-on-Chip (SoC) Field-Programmable Gate Array (FPGA) development kit for its own low-power, low-cost, PolarFire SoC FPGA.

Actively Smart True Wireless Earbuds: How to Augment Your Hearing

September 3, 2020 by Joao Martins

Actively Smart True Wireless Earbuds: How to Augment Your Hearing

IFA 2020, in Berlin, Germany, was "the first major global fair for consumer and home electronics" to physically take place since the pandemic. This limited push to promote a trade show again, lead some major consumer electronics companies and brands to converge their announcements in the week from September 1-5, with showcases streamed to the world live from the Berlin exhibition grounds. Some announcements were relevant to the audio industry and included the Qualcomm press conference, which used the opportunity to launch its latest Adaptive ANC platform, an important step towards smart true wireless earbuds.

Qualcomm Unveils Breakthrough Adaptive Active Noise Canceling Technology for True Wireless Earbuds

September 3, 2020 by audioXpress Staff

Qualcomm Unveils Breakthrough Adaptive Active Noise Canceling Technology for True Wireless Earbuds

Qualcomm Technologies International, a subsidiary of Qualcomm Incorporated, launched Qualcomm Adaptive Active Noise Cancellation (ANC) a new technology designed to deliver an improved user experience for earbuds with integrated ANC. The Adaptive ANC technology is designed to enhance user comfort and provide consistent sound quality for true wireless earbuds by adapting its performance to meet variations in how an earbud fits in a user’s ear, and adapt in real-time to changes in fit as the earbuds are in use.

Dolby MS12 Multistream Decoder Now Supported and Approved on CEVA’s Audio DSP

July 28, 2020 by audioXpress Staff

Dolby MS12 Multistream Decoder Now Supported and Approved on CEVA’s Audio DSP

CEVA announced support for latest Dolby MS12 Multistream Decoder on the CEVA-BX2 audio DSP. The integration provides System-on-Chip (SoC) designers and device manufacturers with a low power, rapid time-to-market solution that will enable complete support for Dolby's latest family of formats and audio codecs, including Dolby Atmos, Dolby AC-4, and Dolby Audio. This makes the CEVA-BX2 an ideal solution for new Smart TVs, soundbars and more designs, benefiting of all the included audio DSP features, such as far-field noise reduction and AI speech recognition.

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