All items tagged with product development and Intel (10)

Airoha Works with Intel to Facilitate the Development of New Bluetooth LE Audio Devices

December 6, 2023 by Joao Martins

Airoha Works with Intel to Facilitate the Development of New Bluetooth LE Audio Devices

Airoha Technology, a subsidiary of Mediatek and one of the world's top designers of Bluetooth audio ICs, announced a collaboration with Intel and Engineered for Intel Evo laptop accessory program, which is the first of its kind to fully embrace Bluetooth LE Audio support. Airoha will supply its SoCs and Software Development Kit (SDK) to support development of new Bluetooth LE Audio devices.

Cirrus Logic Helps Ease PC Industry Transition to New MIPI SoundWire Interface

August 2, 2023 by audioXpress Staff

Cirrus Logic Helps Ease PC Industry Transition to New MIPI SoundWire Interface

Cirrus Logic is offering an advanced audio solution to help ease PC manufacturers' migration to the MIPI SoundWire interface (1.2.1 specification) for a richer, more immersive audio experience. At the heart of the Cirrus Logic advanced, low-power audio solution are the company’s recently announced CS35L56 smart amplifier and CS42L43 Smart HIFI codec that are included in the Intel SoundWire-ready reference design aimed at helping laptop designers make a smooth migration to the new specification.

CEVA Audio DSPs and Audio Front-End Software Available Through Intel Pathfinder for RISC-V Program

December 12, 2022 by audioXpress Staff

CEVA Audio DSPs and Audio Front-End Software Available Through Intel Pathfinder for RISC-V Program

CEVA announced that it will make its CEVA-BX1 and CEVA-BX2 Audio DSPs and audio front-end software stack available for commercial developers through the Intel Pathfinder for RISC-V ecosystem. A Strategic Member of RISC-V International, CEVA is making its audio DSPs and software stack accessible for prototyping and production design through the Intel FPGA based pre-silicon development platform.

VESA Publishes Displayport 2.0 Video Standard Leveraging Thunderbolt 3 Physical Interface Layer

June 26, 2019 by audioXpress Staff

VESA Publishes Displayport 2.0 Video Standard Leveraging Thunderbolt 3 Physical Interface Layer

The Video Electronics Standards Association (VESA) announced the DisplayPort 2.0 video standard, the first major update to the DisplayPort standard since March 2016, increasing data bandwidth performance up to three times more than the previous version of DisplayPort 1.4a. Utilizing the Thunderbolt 3 physical interface layer and USB Type-C connector, DisplayPort 2.0 boosts the data and video bandwidth to a maximum payload of 77.37 Gbps, while new built-in features enable improved user experience, provide greater flexibility and improve power efficiency.

Cadence Announces Industry’s First Verification IP for USB4

March 15, 2019 by audioXpress Staff

Cadence Announces Industry’s First Verification IP for USB4

Cadence Design Systems announced the availability of the industry’s first Verification IP (VIP) in support of the recently announced USB4 standard. The Cadence VIP for USB4 enables engineers to develop standard-compliant system-on-chip (SoC) designs, completing functional verification of the design with less effort and greater assurance that the SoC will operate as expected, enabling early adoption of the next-generation USB standard protocol.

Analogix Announces Second Generation ANX74xx Family of 10 Gbps USB 3.2 Single-Chip Re-Timers

January 14, 2019 by Cristina Costa

Analogix Announces Second Generation ANX74xx Family of 10 Gbps USB 3.2 Single-Chip Re-Timers

Analogix Semiconductor announced the availability of its second generation ANX74xx family of 10 Gbps USB-C re-timers capable of switching DisplayPort and USB 3.2 Gen2 signals to support a single USB-C port for next generation high-performance, low-power notebooks, 2-in-1 convertible laptops, desktop PCs, mobile devices, and servers. Built on a market proven architecture, the ANX74xx family complies with USB Repeater Specification for USB Gen 1 (5G) and Gen 2 (10G).

The Linux Foundation Adopts Sound Open Firmware Project Enabling Developers to Adapt Operating Systems for Audio Devices

March 15, 2018 by audioXpress Staff

The Linux Foundation Adopts Sound Open Firmware Project Enabling Developers to Adapt Operating Systems for Audio Devices

During the Embedded Linux Conference in Portland, OR, The Linux Foundation announced that Sound Open Firmware (SOF) has become a Linux Foundation project. With significant engineering and code contributions from Intel Corporation, SOF includes a digital signal processing (DSP) firmware and an SDK that together provide infrastructure and development tools for developers working on audio or signal processing. Intel and Google support SOF and invite others to join them in advancing the project.

Intel Unveils Industry’s First FPGA Integrated with High Bandwidth Memory Built for Acceleration

December 20, 2017 by audioXpress Staff

Intel Unveils Industry’s First FPGA Integrated with High Bandwidth Memory Built for Acceleration

Intel today announced the availability of the Intel Stratix 10 MX FPGA, the industry’s first field programmable gate array (FPGA) with integrated High Bandwidth Memory DRAM (HBM2). By integrating the FPGA and the HBM2, Intel Stratix 10 MX FPGAs offer up to 10 times the memory bandwidth when compared with standalone standard DDR 2400 DIMM memory solutions.

Intel Announces New Development Kit for Far-Field Alexa-Enabled Products

November 2, 2017 by audioXpress Staff

Intel Announces New Development Kit for Far-Field Alexa-Enabled Products

Intel has announced the Intel Speech Enabling Developer Kit, designed for manufacturers and developers to quickly bring new Alexa-enabled products to market. This kit is the first audio front end solution that combines far-field voice processing and "Alexa" wake word detection on a single chip. It is based on a new digital signal processor (DSP) architecture from Intel that enables high-quality voice capture in acoustically challenging environments.

Intel Introduces Versatile New Cyclone 10 FPGA Family with Huge Potential in Audio and Video Applications

February 14, 2017 by audioXpress Staff

Intel Introduces Versatile New Cyclone 10 FPGA Family with Huge Potential in Audio and Video Applications

Since completing the acquisition of Altera, in December 2015, Intel has been delivering on its promise to introduce new classes of field-programmable gate array (FPGA) technologies. Specifically to serve the growing number of Internet of Things (IoT) applications, Intel announced the Intel Cyclone 10 family of FPGAs. Designed to deliver fast and power-efficient processing, they have a variety of uses, including for automotive, industrial automation, pro audio visual and vision systems.