All items tagged with product development and Fraunhofer IIS (19)

Bluetooth Wireless Audio, Innovations in Audio, and More in audioXpress December 2024

November 12, 2024 by audioXpress Staff

Bluetooth Wireless Audio, Innovations in Audio, and More in audioXpress December 2024

audioXpress December 2024 features a comprehensive report on Bluetooth LE Audio and Auracast, the suppliers and development ecosystem. Jonny McClintock adds insights on Ultra-Low Latency Audio Transmission over Bluetooth LE Audio. Plus three reviews of the QuantAsylum QA403 Audio Analyzer, the DPS-2 Power Supply and LNI-2 DC Filter and Stabilizer from RME Audio, and the SPL Phonitor 3 DAC, Headphone Amplifier and Monitor Controller. Hans Polak details his extensive experiments on Moving Magnet Cartridges.

CML Micro Launches Affordable Digital Radio Mondiale (DRM) Receiver Module

May 21, 2024 by Joao Martins

CML Micro Launches Affordable Digital Radio Mondiale (DRM) Receiver Module

CML Micro announced the availability of a complete Digital Radio Mondiale broadcast receiver, making DRM-capable radio more cost-effective and accessible worldwide. The UK-based RF chip company launched the DRM1000 module – a complete DRM implementation that will enable consumer radio manufacturers to connect communities with low-cost, low-power DRM radio designs. The module is a joint development, combining CML Micro's expertise in wireless IC design with Cambridge Consultants' digital signal processing know-how.

Tymphany and Fraunhofer IIS Present Spatial Audio Reference Designs for Headphones and Speakers at CES 2024

January 2, 2024 by audioXpress Staff

Tymphany and Fraunhofer IIS Present Spatial Audio Reference Designs for Headphones and Speakers at CES 2024

Following the announcement that Tymphany partnered with the Fraunhofer Institute for Integrated Circuits (IIS) in Germany to provide new state-of-the-art spatial audio solutions to audio manufacturers, Tymphany now confirms that at the CES 2024 show in Las Vegas, the two companies will demonstrate new reference designs for both headphones and speakers. These demonstrations will take place at Suite #26336 of the Venetian.

Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP

December 15, 2023 by Joao Martins

Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP

The Fraunhofer Institute for Integrated Circuits (IIS), headquartered in Erlangen, Germany, and Tymphany have partnered to provide state-of-the-art spatial audio solutions to audio manufacturers. The two companies have worked together to integrate Fraunhofer's audio processing suites and audio technologies into Flow DSP, Tymphany's own DSP platform and design framework which allows creating immersive audio features in new audio products.

MPEG-H Decoder Implementation Now Available for Cirrus Logic DSPs

January 20, 2023 by Joao Martins

MPEG-H Decoder Implementation Now Available for Cirrus Logic DSPs

RT-RK, a leading embedded software development house, alongside Fraunhofer IIS, the primary developer of the MPEG-H Audio standard, announced the immediate availability of RT-RK's MPEG-H 3D Audio decoder implementation for Cirrus Logic DSPs commonly used in home theater products such as AV Receivers and Soundbars. The successful implementation will further accelerate the development of new products based on these low-cost embedded Cirrus Logic platforms.

Specification Under Development Will Enable LC3plus High-Resolution Codec in Bluetooth LE Audio

December 7, 2022 by Joao Martins

Specification Under Development Will Enable LC3plus High-Resolution Codec in Bluetooth LE Audio

The Bluetooth LE Audio set of specifications, introducing the LC3 codec as the mandatory option for wireless audio streaming, is an important evolution compared to the current default SBC codec. Nevertheless, unlike the current Bluetooth Classic A2DP profile that specifies optional audio codecs, LE Audio didn't offer any options. A recent article in the Fraunhofer IIS blog confirms that a new specification is under development to allow support for the LC3plus high-resolution audio codec.

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

July 11, 2022 by Joao Martins

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

DSP Concepts announced that its Audio Weaver development platform for audio products now also offers access to the Fraunhofer Cingo family of immersive processing tools. The agreement with Fraunhofer IIS allows audio product developers to enhance headphones, earbuds and speakers with binaural audio processing for immersive 3D sound with head tracking, as well as enhance existing stereo content, including loudness optimization and equalization. Cingo supports all channel-based formats and direct rendering of audio objects with associated position metadata, which can be transmitted as MPEG-H Audio.

CES 2022 Audio Highlights. 10 Companies We Want to See and Hear Again!

January 13, 2022 by Joao Martins

CES 2022 Audio Highlights. 10 Companies We Want to See and Hear Again!

It was just like CES 2022 was a blink. We walked all over CES 2022, from hotel suites and halls - literally and virtually - to report on these great audio companies and technologies! Among our #CES2022 audio highlights we discuss presentations and demos from xMEMS Labs, Noveto, Exeger, Mayht, Tectonic, Resonado, Fraunhofer IIS, Silentium, GaN Systems, and Axign. Text and CES report originally published in The Audio Voice weekly newsletter.

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

October 29, 2021 by audioXpress Staff

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

Cadence Design Systems announced the new Cadence Tensilica HiFi 1 DSP, delivering increased voice- and music-processing performance with optimal neural network capability in a compact footprint with ultra-low energy, improving the user experience and extending battery life. The Tensilica HiFi 1 DSP is now the smallest and lowest power member of the HiFi DSP family, developed for battery-constrained applications, such as mobile, hearables, wearables, automotive, and connected devices.

October 20, 2020 by audioXpress Staff

MPEG-H 3D Audio Baseline Profile Now Supported by Analog Devices’ DSPs

Fraunhofer IIS announced that Analog Devices is offering certified decoder implementations supporting the new MPEG-H 3D Audio Baseline Profile on its ADSP-215xx series of audio digital signal processors (DSPs). Analog Devices's DSPs are used extensively for audio video receivers, soundbars, speakers and headphones. Adding MPEG-H 3D Audio Baseline Profile decoding capabilities to Analog Devices’ ADSP-215xx series of audio DSPs will bring immersive and personalized audio experiences to more consumers.

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