All items tagged with product development and Bluetooth Low Energy (38)

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

VeriSilicon Now Offers Fully Compliant Bluetooth LE Audio IP Solutions

April 1, 2024 by Joao Martins

VeriSilicon Now Offers Fully Compliant Bluetooth LE Audio IP Solutions

VeriSilicon Microelectronics announced that its complete Bluetooth Low Energy (BLE) IP solution has achieved full LE Audio specification compliance, including certifications for the LE Audio protocol stack and Low Complexity Communications Codec (LC3). The Shanghai, China-based company is now able to offers manufacturers, ODMs and OEMs its own range of wireless audio and DSP solutions enabling higher quality audio streaming across various applications with lower power and cost.

IOT747 and AntennaWare Launch Reference Design for Wearable Applications

February 16, 2023 by Joao Martins

IOT747 and AntennaWare Launch Reference Design for Wearable Applications

IOT747, a Cambridge, UK-based supplier of wireless modules and solutions announced a partnership with AntennaWare, the Northern Ireland-based developer of Bluetooth and Ultra-Wideband (UWB) antenna solutions for wireless wearables. The partnership integrates AntennaWare BodyWave Antenna with the IDC737 Bluetooth module in an example reference design for long-range and wearable applications.

Specification Under Development Will Enable LC3plus High-Resolution Codec in Bluetooth LE Audio

December 7, 2022 by Joao Martins

Specification Under Development Will Enable LC3plus High-Resolution Codec in Bluetooth LE Audio

The Bluetooth LE Audio set of specifications, introducing the LC3 codec as the mandatory option for wireless audio streaming, is an important evolution compared to the current default SBC codec. Nevertheless, unlike the current Bluetooth Classic A2DP profile that specifies optional audio codecs, LE Audio didn't offer any options. A recent article in the Fraunhofer IIS blog confirms that a new specification is under development to allow support for the LC3plus high-resolution audio codec.

Microchip Announces New Arm-Based PIC with Built-in Bluetooth Low Energy Connectivity

October 19, 2022 by Cristina Costa

Microchip Announces New Arm-Based PIC with Built-in Bluetooth Low Energy Connectivity

Microchip Technology introduced its first Arm Cortex-M4F-based PIC microcontroller (MCU) family that solves basic wireless connectivity design challenges by integrating Bluetooth Low Energy functionality directly into one of a system’s most basic components, supported by one of the industry’s most comprehensive developer ecosystems. Microchip's new PIC32CX-BZ2 MCU family is available in SoCs QFN packages and complete PCB modules and antenna.

Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference

September 16, 2022 by Joao Martins

Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference

Silicon Labs announced a slate of new multiprotocol connectivity products that are driven by interoperability, advancing innovations in the Internet of Things and Smart Home, including Matter and Wi-Fi 6. Standing out among the announcements is the new low power SiWx917 Wi-Fi 6 and Bluetooth LE combination SoC that Silicon Labs says is Matter-ready. The SoC includes an integrated applications processor, and is ideal for battery-powered or energy-efficient connected devices with always-on cloud connectivity.

SPARK Microsystems Shows Way-Forward for Wireless Audio Over UWB

July 28, 2022 by Joao Martins

SPARK Microsystems Shows Way-Forward for Wireless Audio Over UWB

SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation ultra-wideband (UWB), has recently teamed up with the UWB Alliance, the international non-profit organization dedicated to the promotion and growth of UWB, in a joint effort to test the coexistence and aggregation capabilities of the technology in environments where other UWB or other wireless protocols and radio devices are in use. And wireless audio is among the most promising applications that SPARK Microsystems is testing over UWB.

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

June 22, 2022 by Cristina Costa

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.

Renesas Develops World's Smaller and Lower Power Bluetooth Low Energy RF Transceiver

February 25, 2022 by audioXpress Staff

Renesas Develops World's Smaller and Lower Power Bluetooth Low Energy RF Transceiver

Renesas Electronics announced the development of two 2.4 GHz RF transceiver technologies that support the Bluetooth Low Energy (LE) low-power, near-field communication standard. The new technologies also achieve a smaller mounting area and better power efficiency. Renesas presented these technologies at International Solid-State Circuits Conference 2022 (ISSCC 2022), held between February 20 and 24 in San Francisco.

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

January 28, 2022 by audioXpress Staff

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

Wireless connectivity specialists Telit announced the launch of their new WE310G4 module, which enables manufacturers to add dual-band Wi-Fi and Bluetooth Low Energy (BLE) 5.0 connectivity quickly and cost-effectively to their products. Based on Realtek's Ameba system on chip (SoC), the WE310G4 is ideal for a wide variety of embedded designs, including smart home devices and appliances, wearables, fitness trackers, smart city sensors, aftermarket telematics and industrial automation sensors.

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