Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

DSP Concepts announced that its Audio Weaver development platform for audio products now also offers access to the Fraunhofer Cingo family of immersive processing tools. The agreement with Fraunhofer IIS allows audio product developers to enhance headphones, earbuds and speakers with binaural audio processing for immersive 3D sound with head tracking, as well as enhance existing stereo content, including loudness optimization and equalization. Cingo supports all channel-based formats and direct rendering of audio objects with associated position metadata, which can be transmitted as MPEG-H Audio.

Immersive 3D/spatial audio - combined with XR/360 video - can transport you away from your home and into the middle of a lush forest with the sound of twigs crunching below you, a deer running off in the East, and the flapping of wings as your eyes follow a cardinal flying away. Accurate head tracking helps deliver a true-to-life user experience (UX), and understanding which factors are key in evaluating a solution will help you navigate this growing industry.

CEVA and VisiSonics are promoting a joint webinar to promote 3D audio technology and emerging applications for immersive listening experiences. 3D Audio for Everyone is the motivation behind this session, targeted directly at audio system engineers, product managers and developers looking to add 3D Audio capabilities to Hearables, Smart Home, Mobile, and Automotive products. Getting spatial audio to work across all platforms is the next exciting frontier in audio. November 23, 2020 at 08:00 AM PST / 11:00 AM EST.

Fraunhofer IIS announced that Analog Devices is offering certified decoder implementations supporting the new MPEG-H 3D Audio Baseline Profile on its ADSP-215xx series of audio digital signal processors (DSPs). Analog Devices's DSPs are used extensively for audio video receivers, soundbars, speakers and headphones. Adding MPEG-H 3D Audio Baseline Profile decoding capabilities to Analog Devices’ ADSP-215xx series of audio DSPs will bring immersive and personalized audio experiences to more consumers.

CEVA and VisiSonics, a developer of patented 3D spatial audio technologies, announced that the companies have collaborated closely together to develop a comprehensive 3D spatial audio solution for embedded devices, including true wireless audio (TWS) earbuds, headphones and other hearables. The collaboration combines VisiSonics' RealSpace 3D audio software optimized for CEVA’s low power audio and sensor hub DSPs together with CEVA’s MotionEngine head tracking algorithms running on its BNO080 9-axis System in Package (SiP).

Waves MaxxAudio and Nx 3D audio processing technologies are now compatible with the new Qualcomm Snapdragon 865, 765 and 765G mobile processors targeting the latest smartphones and powering augmented experiences, gaming, and more. These Waves technologies have been until now mainly available on Intel and ARM processor-based platforms. This new combination will allow manufacturers implementing Snapdragon processors in premium smartphones and smart peripherals to also support expanded audio experiences.

Fraunhofer Institute for Integrated Circuits IIS, the inventor of mp3 and primary developer of the xHE-AAC and MPEG-H Audio standards, announced that NXP Semiconductors has licensed Fraunhofer’s MPEG audio SDK. The complete software package covers four generations of audio codecs, from legacy MPEG Layer-1/2/3 to the next-generation MPEG-H 3D Audio standard and the AAC codec family, including xHE-AAC. NXP will incorporate these codecs in home entertainment product development, from set-top boxes and soundbars to smart speakers.