Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

Nordic Semiconductor announced the launch of a Wafer-Level Chip Scale Package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. The new package option offers the same functionality as the nRF7002 QFN variant but with a footprint reduction of over 60 percent - making the WLCSP the ideal choice for efficient, size-constrained designs for next-generation wireless devices.

Silicon Labs announced a slate of new multiprotocol connectivity products that are driven by interoperability, advancing innovations in the Internet of Things and Smart Home, including Matter and Wi-Fi 6. Standing out among the announcements is the new low power SiWx917 Wi-Fi 6 and Bluetooth LE combination SoC that Silicon Labs says is Matter-ready. The SoC includes an integrated applications processor, and is ideal for battery-powered or energy-efficient connected devices with always-on cloud connectivity.

Increasing worldwide broadband penetration, combined with the adoption of multiple connected devices, bandwidth-intensive, and low latency applications in each household is continuously driving the demand for efficient Wi-Fi Consumer Premises Equipment (CPE) devices. Global tech market advisory firm, ABI Research, forecasts that the Wi-Fi CPE market, including routers, gateways, whole-home mesh systems, access points, and Wi-Fi extenders will generate 221 million unit shipments in 2019.