NXP Advances AI Audio Processing with SAF9xxx Audio DSPs

NXP Semiconductors is improving AI audio capabilities in automotive infotainment and marking a significant improvement in automotive audio processing technology in general with the latest SAF9xxx family of audio DSPs. Utilizing Cadence’s latest generation high-performance Tensilica HiFi 5 DSPs, combined with dedicated neural-network engines, the SAF9xxx audio DSPs enable efficient implementation of next-generation, high-quality, self-learning audio and speech applications.

During its Snapdragon Summit event Qualcomm unveiled the latest S7 and S7 Pro Gen1 Sound platforms, which will soon power a new generation of advanced audio products. The new platforms offer five times the compute power, three times the DSP processing power, and almost 100 times on-device AI processing power compared to the previous generation. A real differentiator is the use of micro-power Wi-Fi to extend wireless audio range and support for up to 192kHz lossless music quality in the S7 Pro.

GreenWaves Technologies, a fabless semiconductor company based in Grenoble, France, has received the funding needed to support the production of its second-generation GAP9 processor. As demonstrated at CES 2023, this advanced AI processor revolutionizes the next generation of true wireless earbuds, hearables, and connected devices with ultra-low latency noise cancellation, neural network-based background elimination and 3D sound.