All items tagged with evaluation kit (26)

Nordic Semiconductor Launches Bluetooth LE Audio Evaluation Platform

January 8, 2020 by audioXpress Staff

Nordic Semiconductor Launches Bluetooth LE Audio Evaluation Platform

Nordic Semiconductor announced it has launched an LE Audio Evaluation Platform in partnership with San Diego, CA-based Bluetooth Low Energy (Bluetooth LE) stack developer, Packetcraft. The LE Audio solution demonstrates the benefits of High-Quality Wireless LE Audio and is designed to support the new LE Audio specifications that are expected to be released by the Bluetooth Special Interest Group (SIG) during the first half of 2020.

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

October 4, 2019 by audioXpress Staff

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

NXP Semiconductors announced the i.MX RT1170 family of crossover MCUs that combines unprecedented levels of performance, reliability, and integration to propel industrial, automotive and consumer machine learning applications. The NXP i.MX RT1170 family reinforces NXP’s commitment to advance edge computing with its EdgeVerse portfolio of solutions and marks a technology breakthrough with MCUs that run up to 1GHz while maintaining low-power efficiency.

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

October 4, 2019 by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.

XMOS Extends Portfolio of Far-Field Voice Capture Solutions with New xCORE VocalFusion Speaker Linear Evaluation Kit

November 30, 2017 by audioXpress Staff

XMOS Extends Portfolio of Far-Field Voice Capture Solutions with New xCORE VocalFusion Speaker Linear Evaluation Kit

XMOS announced commercial availability of the xCORE VocalFusion Speaker Linear evaluation kit as part of its range of innovative far-field voice capture solutions. Based on the XMOS VocalFusion XVF3100 voice processor, the kit is designed for developers, OEMs and ODMs integrating voice user interfaces into flat, or linear consumer electronics typically found at the “edge of the room”, such as smart home control panels and washing machines.

XMOS Introduces XVF3000 Voice Processor for Integrated Far-Field Voice Capture and XMOS VocalFusion Speaker Development Kit

June 15, 2017 by audioXpress Staff

XMOS Introduces XVF3000 Voice Processor for Integrated Far-Field Voice Capture and XMOS VocalFusion Speaker Development Kit

Now on the second generation of its VocalFusion family of voice processors and Voice User Interface (VUI) controller solutions, XMOS announced its new XVF3000 voice processor for integrated far-field voice capture, complemented with the new XMOS VocalFusion Speaker Evaluation Kit with circular microphone array. The new XVF3000 devices and development kits target the exploding category of voice-enabled speakers.

Energy-Friendly IC and Evaluation Kit for iOS Audio Accessory Development

April 7, 2015 by audioXpress Staff

Energy-Friendly IC and Evaluation Kit for iOS Audio Accessory Development

Silicon Labs now offers a digital audio bridge chip and evaluation kit designed to simplify the development of accessories for iOS devices with Lightning connector. Target applications include guitar and microphone recording dongles, audio docks, and headphones. The CP2614 IC also provides built-in support for communication between iOS applications and accessory hardware.

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