All items tagged with development kit (71)

OCA Alliance Introduces New Technologies, New Standards, and Receives Support From New Members

March 9, 2023 by Joao Martins

OCA Alliance Introduces New Technologies, New Standards, and Receives Support From New Members

The ISE 2023 show in Barcelona saw the OCA Alliance bring forward several new developments and announcements that will continue to push the horizons of the AES70 control standard. During the show, presentations, demonstrations, and new members to the trade association showcased current and future technologies and tools that will further broaden the Open Control Architecture (OCA) Ecosystem.

XMOS Launches XVF3800 High-Performance Voice Processor for Enterprise and Consumer Voice Conferencing Platforms

March 7, 2023 by Joao Martins

XMOS Launches XVF3800 High-Performance Voice Processor for Enterprise and Consumer Voice Conferencing Platforms

Anticipating the company's presentation at Embedded World 2023, XMOS has launched the XVF3800, a quick-to-market, high-performance voice processor for enterprise and consumer voice conferencing platforms. The XVF3800 combines acoustic echo cancellation (AEC), multiple adaptive beamformers, noise suppression, AGC, and more, and will be available along with a development kit, the XK-VOICE-SQ66.

Nordic Semiconductor Selects Packetcraft Controller Software Delivering Advanced Bluetooth LE Audio Capability

January 3, 2023 by Joao Martins

Nordic Semiconductor Selects Packetcraft Controller Software Delivering Advanced Bluetooth LE Audio Capability

Packetcraft, a leading provider of Bluetooth embedded stacks and software solutions, announced their Bluetooth Qualified LE Controller is shipping with Nordic Semiconductor’s flagship nRF5340 dual-core Bluetooth 5.3 SoC enabling LE Audio in commercial products. At CES 2023, Packetcraft is already showcasing Bluetooth LE Audio and Auracast broadcast audio applications using Nordic’s nRF5340 SoC, including from Sonical, EMSi and Fanstel.

SPARK Microsystems Shows Way-Forward for Wireless Audio Over UWB

July 28, 2022 by Joao Martins

SPARK Microsystems Shows Way-Forward for Wireless Audio Over UWB

SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation ultra-wideband (UWB), has recently teamed up with the UWB Alliance, the international non-profit organization dedicated to the promotion and growth of UWB, in a joint effort to test the coexistence and aggregation capabilities of the technology in environments where other UWB or other wireless protocols and radio devices are in use. And wireless audio is among the most promising applications that SPARK Microsystems is testing over UWB.

The Acoustical Challenges of Designing True Wireless Earphones

June 28, 2022 by Andrew Bellavia

The Acoustical Challenges of Designing True Wireless Earphones

Expanding the perspective on the evolution toward hearables, this article explores the current trends as well as the acoustical challenges and solutions for designing true wireless earphones. The article explains the enabling technologies currently converging as the TWS market continues to grow and use cases multiply, with more consumers using wireless earbuds for a diverse and varied set of applications, from listening to podcasts and audiobooks to Internet meetings and interacting with voice assistants. This article was originally published in audioXpress, April 2022.

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

June 27, 2022 by Joao Martins

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

Nordic Semiconductor has used the latest trade shows globally to showcase its latest low power wireless solutions, and introduced a series of new development solutions targeting Bluetooth LE Audio. At the Embedded World Exhibition that took place in Nuremberg, Germany, Nordic offered demonstrations of its new nRF5340 Audio Development Kit (DK), a design platform for rapid development of LE Audio products, and the Nordic Thingy:53 a rapid prototyping solution, both based on Nordic’s nRF5340 SoC.

Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs

June 22, 2022 by audioXpress Staff

Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs

Texas Instruments expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of typical competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is priced to start as low as $0.79, making it affordable for engineers to add Bluetooth LE connectivity to more products.

Nordic Semiconductor nRF5340 Audio DK Accelerates Bluetooth LE Audio Developments

May 20, 2022 by Cristina Costa

Nordic Semiconductor nRF5340 Audio DK Accelerates Bluetooth LE Audio Developments

The next generation of wireless audio projects is now getting on the bench, as developers get access to the first Bluetooth LE Audio evaluation platforms. Nordic Semiconductor has long been a reference in Bluetooth development platforms and has now released its nRF5340 Bluetooth LE Audio DK board, which includes everything required for developers to take advantage of the latest Bluetooth standard, including LC3 codec, low power consumption, and wireless stereo enhancements.

Development and Design: Sound Level Evaluation for Raspberry Pi 4

April 13, 2022 by Ben Chen

Development and Design: Sound Level Evaluation for Raspberry Pi 4

This article proposes a Sound Level Evaluation solution based on the popular Raspberry Pi 4 and the possibilities of using the Sfera Labs' Exo Sense Pi - a compact multi-sensor module - as a sound meter. The Exo Sense Pi combines several environmental sensors and connectivity options, and integrates a digital microphone which can be used to evaluate ambient noise levels or measuring noise sources. This article was originally published in audioXpress, March 2022.

Microchip Enables Qi 1.3 Wireless Charging with Authentication

March 30, 2022 by audioXpress Staff

Microchip Enables Qi 1.3 Wireless Charging with Authentication

In order to ensure high quality wireless charging power transmitters, the Wireless Power Consortium (WPC) has released the Qi 1.3 Wireless Charging specification with the extended power profile. This new specification created demand for high security silicon authentication devices for full-service support. In response, Microchip Technology announced the new industrial grade TrustFLEX ECC608 and the automotive grade Trust Anchor TA100 combined with Microchip secure key provisioning services for Qi 1.3 power transmitters.

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