All items tagged with Bluetooth LE (20)

Rohde & Schwarz and Ceva Announce Over-the-Air Bluetooth Test Solution

March 5, 2025 by Joao Martins

Rohde & Schwarz and Ceva Announce Over-the-Air Bluetooth Test Solution

The next Bluetooth release is expected to be ratified soon. One important new feature is the Unified Test Protocol (UTP) Test Mode for Bluetooth Low Energy, that will complement existing test methods. The UTP Test Mode will additionally enable over-the-air (OTA) controlled device testing, which will simplify measurements of small and highly integrated devices enormously, since no direct wired connection to the tester is needed. Rohde & Schwarz and Ceva, in close cooperation, have developed a solution for this new test mode.

Silicon Labs Introduces BG22L and BG24L "Lite" Bluetooth LE SoCs

January 31, 2025 by audioXpress Staff

Silicon Labs Introduces BG22L and BG24L "Lite" Bluetooth LE SoCs

Silicon Labs introduced the BG22L and BG24L SoCs for Bluetooth LE connectivity, with "L" representing the new application-optimized Lite devices. These new ultra-low power Bluetooth devices are optimized for applications like asset tracking tags, remote control, and small appliances. The BG22L delivers robust security and processing for common Bluetooth devices, while BG24L supports advanced AI/ML acceleration and Channel Sounding.

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

November 12, 2024 by Joao Martins

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

The nRF54L wireless SoCs are one of the biggest product launches of the electronica 2024 show in Munich, and they redefine once again Nordic Semiconductor’s lead in ultra-low power wireless for connected devices. The new nRF54L Series includes the previously announced nRF54L15, and the new nRF54L10 and nRF54L05 wireless SoCs. This advanced product series offers significantly enhanced efficiency, exceptional processing power, and versatile design options to meet a growing range of Bluetooth LE applications, including LE Audio and Auracast products.

Ellisys Bluetooth Vanguard Advanced Protocol Analysis System Supports Next-Gen Bluetooth Features

May 29, 2024 by audioXpress Staff

Ellisys Bluetooth Vanguard Advanced Protocol Analysis System Supports Next-Gen Bluetooth Features

Ellisys, a leading provider of protocol test, analysis, and qualification solutions for Bluetooth technology, Universal Serial Bus (USB), and other wired and wireless technologies, announced pre-standard support for several upcoming, unreleased major Bluetooth technological advancements. The company's Vanguard all-in-one Bluetooth protocol analysis system now supports High Data Throughput, Higher Bands, and Channel Sounding capabilities.

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

April 12, 2024 by Joao Martins

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

Teledyne LeCroy is enabling the development of the latest wireless devices and connected applications with the launch of the Frontline X500e wireless protocol analyzer with Wi-Fi 7. For any application involving Bluetooth, Wi-Fi, 802.15.4-based technologies (including Matter, Thread, and Zigbee), or wired interfaces such as HCI-UART, USB, SPI, and Audio I2S, the X500e delivers precise insights for network professionals.

Nordic Semiconductor Offers Wireless Audio Solution for Battery-Powered High Quality Designs

November 20, 2023 by audioXpress Staff

Nordic Semiconductor Offers Wireless Audio Solution for Battery-Powered High Quality Designs

Nordic Semiconductor has revealed that Yinzida Technology, a consumer electronics manufacturer, has designed a 2.4GHz wireless audio transmission module that enables high fidelity wireless audio in applications such as microphones, musical instruments or audio headsets. This out-of-the-box, lossless and stable wireless audio solution is ideal for battery-powered designs with zero-delay DSP pipeline, using Nordic's nRF52832 SoC in both transmitter and receiver.

STMicroelectronics Simplifies Wireless Product Development With Certified STM32WB1MMC Bluetooth LE Module

March 16, 2023 by audioXpress Staff

STMicroelectronics Simplifies Wireless Product Development With Certified STM32WB1MMC Bluetooth LE Module

The new STM32 Bluetooth wireless module from STMicroelectronics lets designers access the advantages of ST’s dual core STM32WB microcontrollers (MCUs), especially in projects intended for low-to-medium production volumes. The module simplifies development and accelerates time to market, combining Bluetooth Low Energy 5.3 certification and worldwide radio-equipment approvals with the STM32Cube ecosystem support.

U-blox IRIS-W1 Tri-Radio Stand-Alone Module Features Dual-Band Wi-Fi 6, Bluetooth LE 5.3 and Matter Support

March 15, 2023 by audioXpress Staff

U-blox IRIS-W1 Tri-Radio Stand-Alone Module Features Dual-Band Wi-Fi 6, Bluetooth LE 5.3 and Matter Support

U-blox has announced IRIS-W1, its first compact stand-alone Wi-Fi module combining dual-band Wi-Fi 6, Bluetooth LE (Low Energy) 5.3, and Thread including support for Matter. IRIS-W1 comes in four variants, each enabling the user to select among various antennas and software environments. The u-blox IRIS-W1 offers a powerful wireless MCU and delivers high-standard security to support a wide range of market segments.

Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference

September 16, 2022 by Joao Martins

Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference

Silicon Labs announced a slate of new multiprotocol connectivity products that are driven by interoperability, advancing innovations in the Internet of Things and Smart Home, including Matter and Wi-Fi 6. Standing out among the announcements is the new low power SiWx917 Wi-Fi 6 and Bluetooth LE combination SoC that Silicon Labs says is Matter-ready. The SoC includes an integrated applications processor, and is ideal for battery-powered or energy-efficient connected devices with always-on cloud connectivity.

Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC

July 21, 2022 by Cristina Costa

Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC

Dolphin Design, an advanced chip design company and leading specialist in Edge Computing and AI platforms, and Big Fish Semiconductor have entered into a long-term partnership. Big Fish Semiconductor’s U2 BLE 5.2 Audio AI SoC (TSMC 40nm uLP process ultra-low power audio chip), now in mass fabrication, is the first outcome of this partnership. The high-performance recording capabilities of the U2 BLE 5.2 Audio AI SoC are made possible by Dolphin Design's 24-bit delta-sigma audio ADC, which combines superior audio performance, small area and ultra-low power consumption.

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